PD IEC/TR 61189-3-914:2017 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2017 г.
- ICS:
- 31.180
- SKU:
- PD IEC/TR 61189-3-914:2017
Abstract
What is PD IEC/TR 61189-3-914 - Thermal conductivity of printed circuit boards about?
PD IEC/TR 61189-3-914 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures. PD IEC/TR 61189-3-914 specifies the detailed procedures and precautions for IEC 61189-3-913 .
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