PD IEC TR 61760-3-1:2022 PDF
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Название (английский):
PD IEC TR 61760-3-1:2022
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 октября 2022 г.
- ICS:
- 31.190
- SKU:
- PD IEC TR 61760-3-1:2022