PD IEC/TR 62866:2014 PDF
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 7 мая 2014 г.
- ICS:
- 31.180
- SKU:
- PD IEC/TR 62866:2014
Abstract
1 Scope This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
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