Device embedding assembly technology - Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology - Guidelines. Accelerated stress testing of passive embedded circuit boards
What is PD IEC TR 62878‑2‑7- Guidelines for accelerated stress testing of passive embedded circuit boards about?
PD IEC TR 62878 is a technical report on device embedding assembly technology. PD IEC TR 62878‑2‑7 provides guidelines for accelerated stress testing of passive embedded circuit boards to ensure high-quality circuit boards and evaluate failures in passive embedded circuit boards. PD IEC TR 62878‑2‑7 is the seventh subpart of the second part of a multi-part series that describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
Who is PD IEC TR 62878‑2‑7- Guidelines for accelerated stress testing of passive embedded circuit boards for?
PD IEC TR 62878‑2‑7 o...
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