Найдено: 2
Overview IEC 60749-22-1:2025 is a critical international standard from the International Electrotechnical Commission (IEC) detailing mechanical and climatic test methods for semiconductor devices, sp…
1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be…