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Overview IEC 61249-4-1:2008 specifies requirements for epoxide woven E-glass prepreg of defined flammability used mainly as bonding sheets for the manufacture of multilayer printed boards. The prepre…
Overview IEC 61249-4-15:2009 is an international sectional specification for unclad prepreg materials used as bonding sheets in the manufacture of multilayer printed boards. The standard covers a mul…
Overview IEC 61249-4-19:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for high-performance, non-halogenated epoxid…
Overview IEC 61249-4-17:2009 sets out the requirements and properties for non-halogenated epoxide woven E-glass prepreg materials used primarily as bonding sheets in the manufacture of multilayer pri…
Overview IEC 61249-4-16:2009 specifies requirements for unclad prepreg materials used as bonding sheets in the manufacture of rigid multilayer printed boards (PCBs), specifically targeting materials…
Overview IEC 61249-4-12:2005 specifies the requirements for non-halogenated multifunctional epoxide woven E-glass prepreg materials of defined flammability, primarily intended as bonding sheets in co…
Overview IEC 61249-4-11:2005 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on materials for printed boards and other interconnecting structure…
Overview IEC 61249-4-18:2013 is an international standard specifying high-performance epoxide woven E-glass prepreg materials for use in the manufacture of multilayer printed circuit boards (PCBs). T…
Overview IEC 61249-4-14:2009 is an IEC sectional specification for epoxide woven E‑glass prepreg used as unclad bonding sheets in the manufacture of multilayer printed circuit boards (PCBs). The stan…