Найдено: 6
1 Scope This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electro…
1 Scope This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate…
Overview IEC 63378-3:2025 is an international standard published by the International Electrotechnical Commission (IEC). It defines the thermal circuit network model for discrete semiconductor packag…
Overview IEC 63378-6:2026 is an international standard developed by the International Electrotechnical Commission (IEC), focusing on the thermal standardization of semiconductor packages. Specificall…
Overview IEC 63378-2-1:2024 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on thermal standardization of semiconductor packages. Specifically,…