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Overview ISO 9455-17:2024 - "Soft soldering fluxes - Test methods - Part 17" defines standardized test methods to evaluate the electrical and electrochemical effects of flux residues left after solde…
Overview ISO 9455-6:2022 specifies test methods for the determination and detection of ionic halide (excluding fluoride) content in soft soldering fluxes. Halides are reported as chlorides. The stand…
Overview ISO 9455-10:2012 specifies a laboratory method to determine the efficacy of soft soldering fluxes using the solder spread method (also called the flux efficacy test). The method measures how…
Overview ISO 9455-13:2017 - "Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering" specifies a qualitative laboratory method to estimate the tendency of liquid soft solder…
Overview ISO 9455-1:2022 defines a gravimetric test method for determining the content of non-volatile matter in soft soldering fluxes. This standard applies specifically to liquid and paste fluxes o…
Overview ISO 9455-5:2020 - "Soft soldering fluxes - Test methods - Part 5: Copper mirror test" specifies a qualitative laboratory method to assess the aggressiveness of a soft‑soldering flux toward c…
Overview ISO 9455-16:2019 specifies a standardized flux efficacy test using the wetting balance method to assess how well a liquid soft-soldering flux promotes wetting of a metal surface by molten so…
Overview ISO 9455-9:2020 establishes a standardized test method for determining the ammonia content in soft soldering fluxes, specifically targeting fluxes classified as class 311 and 321 according t…
Overview ISO 9455-18:2024 - Soft soldering fluxes - Test methods - Part 18 specifies test methods to assess the cleanliness of soldered printed circuit assemblies (PCBs) before and/or after soldering…
Overview ISO 9455-14:2017 specifies a qualitative method for assessing the tackiness of flux residues left after soft soldering processes. The method applies to all flux forms: solid and paste fluxes…
Overview ISO 9455-8:1991 is an international standard developed by the International Organization for Standardization (ISO) that specifies a test method for the determination of zinc content in soft…
Overview ISO 9455-15:2017 - Soft soldering fluxes - Test methods - Part 15: Copper corrosion test - specifies a qualitative laboratory method to evaluate the corrosive properties of flux residues on…
Overview ISO 9455-3:2019 is an internationally recognized standard that specifies test methods for determining the acid value of soft soldering fluxes, specifically types 1 and 2 as defined in ISO 94…
Overview ISO 9455-11:2017 specifies a qualitative laboratory method for assessing the solubility of flux residues from Type 1 soft‑soldering fluxes in a selected solvent. The test evaluates whether a…
Overview ISO 9455-2:1993 specifies a standardized test method for determining the content of non-volatile matter in soft soldering fluxes using an ebulliometric technique. This method applies specifi…
BS EN ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 flu…
1 Scope This document specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1. N…
BS EN ISO 9455-3:1995 specifies two methods for the determination of the acid value of a flux of types 1 and 2 only, as defined in BS EN 29454-1:1994, ISO 9454-1:1990. Method A is a potentiometric ti…
What is ISO 9455 ‑ 3 about? ISO 9455 ‑ 3 is the third element of the multi-series international standard that covers the soft soldering fluxes . ISO 9455 ‑ 3 gives technical specifications such as te…
BS EN ISO 9455-2:1996 specifies an ebulliometric method for the determination of the content of non-volatile matter in soft soldering fluxes. It is applicable to liquid fluxes of classes 1.1.1, 1.1.2…
What is ISO 9455 ‑ 16 - Soft soldering fluxes about? ISO 9455 ‑ 16 specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method, and gives a qua…
1 Scope This part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler metal and is applicable to a…
1 Scope This part of ISO 9455 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.
1 Scope This document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, so…
BS EN ISO 9455-6:1997 specifies three quantitative methods for the determination of the ionic halide (excluding fluoride) content of soldering fluxes. Halides are calculated as chlorides. A useful qu…
1 Scope This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in…
What is ISO 9455-9 about? ISO 9455 ‑ 9 is the ninth element of the multi-series international standard that covers the soft soldering fluxes . ISO 9455-9 specifies a distillation method for the deter…
BS EN ISO 9455-9:1996 specifies a distillation method for the determination of the ammonia content of solid, paste or liquid fluxes. The method is applicable to fluxes of class 3.1.1 only, as defined…
1 Scope This part of ISO 9455 specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative…
What is ISO 9455‑5 about? ISO 9455 ‑ 5 is the fifth element of the multi-series international standard that covers the soft soldering fluxes . ISO 9455 ‑ 5 gives technical specifications such as term…
1 Scope This document specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The te…