SIST EN IEC 60747-15:2025 PDF

Overview

SIST EN IEC 60747-15:2025 (identical to IEC 60747-15:2024) specifies requirements and test methods for isolated power semiconductor devices. It complements general semiconductor device rules in other parts of IEC 60747 and the IEC 60748 IC standards by defining additional ratings, characteristics and measurement procedures specific to discrete isolated power parts and modules. This third edition adds support for intelligent power modules (IPMs), refines thermal characterization and introduces an isolation test option for temperature sensors.

Key topics and technical requirements

• Scope and relationship: Adds device-specific requirements that are additional to other IEC 60747 parts (non‑isolated power devices) and IEC 60748 for ICs.
• Inclusion of IPMs (Annex C): Intelligent Power Semiconductor Modules are now covered, with guidance on control terminals, ratings and protection-function tests.
• Isolation requirements:
  • Defined isolation voltage / isolation test procedures between terminals and baseplate.
  • New optional isolation test between temperature sensor and terminals (clause 6.1.2) when agreed with the user.
  • Partial discharge inception and extinction voltage measurement methods.
• Thermal and electrical characteristics:
  • Thermal resistance is specified and described for each switch (clause 6.2.4), plus transient thermal impedance and test methods.
  • Measurement methods for parasitic inductance and parasitic capacitance (important for switching performance).
  • Tests for peak case non‑rupture current, terminal currents, and thermal compound thickness (Annex B).
• Verification and reliability:
  • Detailed measurement methods (clause 6), acceptance criteria, endurance lists, type tests and routine tests (clause 7).
  • Informative annexes (A–C) provide test circuits, procedures and examples (including IPM protection and switching tests).