Device embedded substrate - Generic specification. Test methods
Device embedded substrate - Generic specification. Test methods
What is BS EN 62878-1-1 - Device embedding assembly technology about? BS EN 62878-1-1 is the first part of the international standard used for device embedding assembly technology that specifies the requirements and test methods. Guidelines in BS EN 62878-1-1 can help you in applying safety requirements while performing the test method. BS EN 62878-1-1 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3 . BS EN 62878-1-1 is applicable to device embedded substrates fabricated by the use of the organic base material, which includes for example active or passive devices, discrete components formed in the fabrication process of the electronic wiring board, and sheet formed components. Note: BS EN 62878-1-1 neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421 .
Who is BS EN 62878-1-1- Device embedding assembly technology for? BS EN 62878-1-1 on device embedding assembly technology is useful for:
Manufacturers of electronic devices Manufacturers of semiconductor devices
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