BS EN IEC 61760-3:2021 PDF
Surface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2021 г.
- ICS:
- 31.190
- SKU:
- BS EN IEC 61760-3:2021
Abstract
What is BS EN IEC 61760 ‑ 3 about?
BS EN IEC 61760 ‑ 3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. Furthermore, BS EN IEC 61760 ‑ ...
Похожие стандарты
Упомянутые в описании и другие стандарты BS
EN IEC 61760-4:2026
ДействующийSurface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive…
Overview EN IEC 61760-4:2026, published by CLC, addresses requirements for surface mounting technology with a specific focus on the classification, packaging, labelling, and handling of moisture sens…