IEC 60068-2-69:2017

Overview

IEC 60068-2-69:2017 is an internationally recognized standard published by the International Electrotechnical Commission (IEC). It focuses on environmental testing, specifically detailing Test Te/Tc: solderability testing of electronic components and printed circuit boards (PCBs) by the wetting balance (force measurement) method. The standard provides comprehensive procedures for assessing the solderability of metallic terminations and metallized solder pads on various electronic components and printed boards.

This 2017 edition consolidates and updates prior standards, including integrating IEC 60068-2-54. It introduces new component types, includes printed board testing, and updates test parameters and calibration protocols. The measurement techniques outlined include the solder bath wetting balance method and the solder globule wetting balance method, applicable to both lead-based and lead-free solder alloys.

Key Topics

• Solderability Testing Methods:

  • Solder bath wetting balance method measures the force of wetting over time as components or printed boards are immersed in a molten solder bath.
  • Solder globule wetting balance method uses solder droplets (globules) for localized force measurement.

• Applicable Materials:

  • Components with metallic terminations.
  • Printed circuit boards with metallized solder pads.
  • Both lead-containing and lead-free solder alloys.

• Test Procedures and Parameters:

  • Preparation of specimens including cleaning and preconditioning.
  • Detailed instructions on solder alloy composition and flux types.
  • Test temperature specifications for different solder alloys.
  • Instrument calibration using a gauge repeatability & reproducibility (R & R) test protocol.

• Measurement and Data Presentation:

  • Force vs. time traces generated during tests.
  • Quantitative analysis of solderability; however, results are not meant for strict pass–fail classifications.
  • Inclusion of criteria guidance for both components and printed boards.

• Latest Enhancements:

  • Integration of previous related IEC standards into a consolidated document.
  • Expanded test coverage to include new component types and printed boards.
  • Improved calibration and equipment verification methods.

Applications

• Electronics Manufacturing Quality Control: Manufacturers use IEC 60068-2-69 to verify that components and PCBs meet solderability requirements critical to reliable solder joint formation in assembly operations. The force measurement method ensures objective evaluation beyond visual inspection.

• Component and PCB Design Validation: Designers and engineers apply these tests to assess new materials and finishes, ensuring manufacturability and long-term reliability, especially with the industry transition to lead-free soldering.

• Research and Development: R&D teams employ wetting balance methods to study the wetting behavior of novel solder alloys, flux formulations, and surface finishes on electronic components and substrates.

• Supplier Qualification: Procurement and quality departments use IEC 60068-2-69 testing protocols to qualify components and printed boards from suppliers, ensuring compliance with solderability standards.

• Environmental and Reliability Testing: The standard fits within broader environmental testing frameworks to evaluate how electronic assemblies will perform under various conditions and over time.

Related Standards

• IEC 60068-2-54: Related environmental test focusing on resistance to soldering heat, now integrated into IEC 60068-2-69.
• IPC-J-STD-002 and IPC-J-STD-003: Industry standards that specify requirements for solderability of component leads and printed circuit boards, referenced for flux selection and test flux rationale.
• IEC 60068 Series: Other related parts of IEC 60068 that cover environmental testing methods for electronic equipment.
• IPC-A-610: Acceptability standard for electronic assemblies, often used in conjunction with solderability tests to assess assembly quality.
• JEDEC JESD22-B102: Test method for solderability focused on different techniques but complementary in overall solder joint reliability assurance.

IEC 60068-2-69:2017 provides a robust and standardized approach for solderability testing via the wetting balance method, critical to ensuring high-quality solder joints and the reliability of electronic components and printed circuit boards. It supports manufacturers, designers, and quality professionals worldwide in setting consistent standards for electronic assembly processes.