IEC 60068-2-83:2025

Overview

IEC 60068-2-83:2025 - Environmental testing, Part 2-83 - defines methods for solderability testing of electronic components for surface mounting devices (SMD) using the wetting balance method with solder paste. The 2025 edition is published as an RLV (Redline Version) showing technical changes versus the previous edition, including a revision of Clause 5 to align with IEC 60068‑2‑20:2021. The standard is intended for comparative investigation of wettability of metallic or metallized terminations; results are not specified as absolute pass/fail criteria.

Key Topics and Requirements

• Scope and intent: Comparative wetting-balance evaluation using solder paste for SMD terminations; guidance on equipment, procedures and data presentation.
• Test methods covered:
  • Quick heating method
  • Synchronous method
  • Temperature profile method
• Test stages and preparation:
  • Preconditioning of components
  • Solder paste selection and handling
  • Test jig plate and specimen holder design
  • Equipment requirements (measuring, heating, lift systems)
• Test execution and output:
  • Immersion/withdrawal conditions, feed of solder paste
  • Temperature control and profiling
  • Data acquisition, typical output signal shapes, and result presentation
• Data interpretation:
  • Characterisation parameters and examples
  • Informative annexes for reading output data and applying corrections
  • Caveats and influences (solder paste, component construction) on results
• Documentation: Annexes include normative equipment specifications and informative guidance for corrections, caveats and example interpretations.

Applications and Who Uses It

IEC 60068-2-83:2025 is useful for:

• Component manufacturers validating SMD terminal finishes and new solder paste formulations.
• Contract manufacturers and PCB assemblers evaluating wetting behaviour in paste-based processes (reflow-prone environments).
• Test laboratories and quality teams performing comparative solderability characterisation for reliability assessment.
• Procurement and reliability engineers who need comparative data to select components and solder materials.

Practical uses include comparing termination finishes, troubleshooting poor wetting in reflow processes, screening new component lots, and supporting supplier qualification.

Related Standards

• IEC 60068-2-58 - solderability testing for SMD using solder bath and reflow with visual evaluation.
• IEC 60068-2-69 - wetting balance evaluation using solder bath and solder globule method.
• IEC 60068‑2‑20:2021 - referenced alignment for preconditioning procedures (Clause 5).

Keywords: IEC 60068-2-83:2025, solderability testing, wetting balance, solder paste, SMD, surface mount devices, environmental testing, solderability methods.