IEC 60191-5:1997

Overview

IEC 60191-5:1997 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the mechanical standardization of semiconductor devices, specifically integrated circuit (IC) packages using Tape Automated Bonding (TAB) technology. This standard provides key recommendations for the dimensional and structural requirements of IC packages assembled with TAB tape, which serves as both the mechanical support and electrical interconnection medium.

The standard applies to ICs supplied by manufacturers to users in TAB packages, emphasizing tape dimensions, lead configurations, and bonding requirements for both inner lead bonding (ILB) and outer lead bonding (OLB). It plays a crucial role in ensuring consistent quality, compatibility, and interoperability in semiconductor packaging using TAB.

Key Topics

• Scope and Application:
  IEC 60191-5 addresses packages where TAB is the principal component for structural and interconnection functions. It applies to tape with bonded ICs supplied directly by manufacturers to users, excluding internal company processes like using TAB for QFP assembly.

• Tape Format and Dimensions:
  The standard outlines precise tape widths, sprocket hole sizes, and spacing, largely derived from motion picture film standards to maintain reliable tape handling and feeding in manufacturing equipment.

• Body Size and Lead Patterns:
  Recommendations include detailed dimensional requirements for the IC body size, outer lead configurations, and test pad patterns for electrical testing and probing.

• Maximum Lead Counts:
  It defines the maximum number of external connections (leads) the tape packages can accommodate, supporting the design of high-density IC packages.

• Bonding Requirements:
  The standard covers requirements for inner lead bonding (ILB) and outer lead bonding (OLB) processes, critical to ensure robust electrical connections and mechanical stability.

• Variation Codes and Numbering:
  It provides codes for variations in package design and clear numbering schemes for both outer leads and test pads to standardize identification and assembly.

• Annexes:
  Informative annexes summarize recommended TAB package configurations (super format and wide format) and detailed numbering conventions.

Applications

IEC 60191-5:1997 is highly valuable for:

• Semiconductor manufacturers designing and supplying TAB-packaged ICs, enabling standardized dimensions and bonding techniques that facilitate global interoperability.

• Electronics assembly plants that integrate TAB-packaged ICs into printed circuit boards (PCBs) or multi-chip modules, ensuring compatibility with automated machinery.

• Quality and reliability engineers ensuring mechanical and electrical integrity of TAB devices through adherence to bonding and lead layout recommendations.

• Test and inspection service providers using the standardized test pad patterns and numbering for efficient IC functional verification.

By following IEC 60191-5, the semiconductor industry benefits from improved manufacturing consistency, reduced assembly errors, and enhanced product reliability. The standard supports advanced packaging solutions where TAB technology is favored for fine-pitch interconnects and high-density IC layouts.

Related Standards

For comprehensive semiconductor device standardization, IEC 60191-5 is part of a wider series:

• IEC 60191 series: Covers various mechanical packages for semiconductor devices including Dual In-line Package (DIP), Small Outline Package (SOP), and Quad Flat Package (QFP).

• IEC 50 (IEV): The International Electrotechnical Vocabulary provides terminology harmonized across IEC standards.

• IEC 27, IEC 417, IEC 617, IEC 878: Define graphical and letter symbols used in electrotechnical schematics and equipment, referenced for consistent symbol usage in documentation.

The IEC collaborates with ISO to align semiconductor packaging standards with broader international industrial needs, ensuring global applicability.

Keywords: IEC 60191-5, tape automated bonding, TAB packaging, semiconductor mechanical standardization, integrated circuit packages, inner lead bonding, outer lead bonding, semiconductor device dimensions, TAB tape requirements, IC package standard, semiconductor assembly standards, IC testing pads, semiconductor manufacturing standards.