IEC 60191-6-6:2001

Overview

IEC 60191-6-6:2001 is an IEC design guide for the mechanical standardization of fine-pitch land grid array (FLGA) surface-mounted semiconductor packages. It defines common outline drawings, dimensional rules and classification for square-bodied FLGA packages whose terminal pitch (e) is ≤ 0.80 mm and whose terminal height is ≤ 100 µm. The standard aims to promote interchangeability and consistent outline documentation for FLGA package families.

Key topics

• Scope and classification
  • Applies to square FLGA packages with terminal pitch e = 0.80, 0.65, 0.50, 0.40 mm.
  • Material designations: P-FLGA (plastic/interposer resin) and C-FLGA (ceramic).
  • Package body types: flanged type and type of real chip size.
• Outline drawing rules
  • Defines datums (A, B, primary datum S) and seating plane (by least squares of spherical crowns of terminals) for consistent drawing and measurement.
  • Specifies visible index zones, terminal arrays and geometry annotations.
• Dimensional groups and limits
  • Grouped dimension tables for: mounting/interchangeability, mounting/gauging, automated handling, and informational dimensions.
  • Typical dimensional parameters include body sizes (D, E), terminal pitch (e), terminal diameter/land size (b, b2), offsets (ZD, ZE) and overhang rules.
• Ball/matrix guidance
  • Table-based guidance on maximum terminal matrix sizes and recommended matrix families for each pitch (examples for 4×4 up to 26×26 depending on e).
• Purpose
  • Standardizes outline drawings to support PCB footprint design, pick-and-place handling, gauging and interchangeability among manufacturers.

Applications

Who uses IEC 60191-6-6 and why:

• Package designers - to create compliant FLGA outline drawings and select matrix/land layouts.
• PCB layout engineers - to design footprints and land patterns compatible with standardized FLGA outlines.
• Assembly/test engineers - to validate mounting/gauging, automated handling and seating plane requirements.
• Procurement / quality teams - to specify interchangeability and acceptance criteria for FLGA components.
• Standards and compliance specialists - for cross-referencing with the IEC 60191 family.

Related standards

• IEC 60191 (all parts) - broader mechanical standardization of semiconductor devices.
• Drafting follows ISO/IEC Directives, Part 3 as noted in the publication.

Keywords: IEC 60191-6-6, FLGA, fine-pitch land grid array, surface mounted semiconductor packages, outline drawings, terminal pitch, P-FLGA, C-FLGA, package interchangeability.