IEC 60286-3:2022
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 170
- Дата публикации:
- 15 ноября 2022 г.
- Издание:
- IEC IS 60286 edition 7 version 1
- ICS:
- 31.020
IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: addition terms and definitions. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre; addition of drive hole to the reel (optional); revision of reel hole diameter tolerances; revision of 72 mm tape size carrier tape width dimension tolerances; addition of Annex B (informative); addition of component size 0201M.
Abstract
Overview - IEC 60286-3:2022 (Packaging of surface mount components on continuous tapes)
IEC 60286-3:2022 is the international standard that defines tape-and-reel packaging requirements for surface-mount components, including components without leads, with lead stumps, and singulated die products (bare die and bumped die / flip chips). This 2022 edition (Edition 7.0) updates dimensional tolerances and adds new definitions, optional reel drive-hole information, an informative Annex B on electrostatic measurements, and the new component size 0201M.
Keywords: IEC 60286-3, packaging of surface mount components, tape-and-reel, SMT packaging, bare die, flip chip, carrier tape, reel dimensions, tape packaging standard.
Key technical topics and requirements
The standard focuses on dimensions and requirements essential for automated handling and includes:
- Tape types and cavity geometry: Specifications for tape types (e.g., punched, pressed, blister, adhesive-backed - types 1a, 1b, 2a, 2b, 3, 4) and their cavity dimensions and pitches.
- Component positioning and tolerances: Limits for tilt, rotation, lateral displacement, and pocket offset to ensure reliable pick-and-place operation.
- Carrier and cover tape requirements: Materials, minimum bending radius, camber limits, and peel/adhesion characteristics for different tape types.
- Reel and drive-hole specifications: Reel diameters, hole diameters, optional drive-hole additions, marking and label areas, and updated reel hole tolerances.
- Polarity/orientation and tape reeling: Rules for component orientation in the tape, leader/trailer formats, and reeling best-practices.
- Die-specific requirements: Special guidance for singulated die packaging including cleanliness and lateral movement control.
- Electrostatic considerations (Annex B): Informative measurement methods for electrostatic potential and charge decay during cover-tape peeling.
Practical applications and who uses this standard
IEC 60286-3 is used to ensure compatibility between packaged components and automated assembly equipment. Typical users:
- Component manufacturers - to design compliant tape-and-reel packaging for automated distribution.
- Packaging suppliers - to produce carrier and cover tapes meeting dimensional and ESD criteria.
- Electronics manufacturers / contract manufacturers (EMS) - to specify acceptable packaging formats for incoming parts and to optimize SMT line uptime.
- Pick-and-place and feeder OEMs - to ensure feeder design matches industry-standard tape/reel geometry.
- Quality and procurement teams - for incoming inspection criteria, supplier contracts, and traceability labeling.
Benefits include reduced machine jams, predictable feeder performance, ESD risk mitigation, and standardized supplier requirements - all supporting higher SMT line efficiency.
Related standards
IEC 60286-3 is part of the IEC 60286 series (packaging of components for automatic handling). For implementation, consult the latest IEC publications and national adaptations to ensure full compliance with local and industry requirements.
For authoritative copies and corrigenda, obtain IEC 60286-3:2022 from the IEC webstore or your national IEC member committee.
Технические детали
- Технический комитет
- TC 40 - Capacitors and resistors for electronic equipment
- SKU
- IEC 60286-3:2022
Похожие стандарты
Упомянутые в описании и другие стандарты IEC
IEC 60286-3:2013
ДействующийPackaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous…
Overview IEC 60286-3:2013 is an international standard developed by the International Electrotechnical Commission (IEC) that governs the packaging of electronic surface mount components (SMCs) on con…
IEC 60286-2:2022
ДействующийPackaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional lea…
Overview IEC 60286-2:2022 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for tape packaging of electronic components wit…
IEC 62590-2-2:2026
ДействующийRailway applications - Electronic power converters for fixed installations - Part 2-2: DC Traction applicatio…
Overview IEC 62590-2-2:2026 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on railway applications, specifically the electronic power converter…
IEC 61753-042-02:2026
ДействующийFibre optic interconnecting devices and passive components - Performance standard - Part 042-02: Plug-pigtail…
Overview IEC 61753-042-02:2026 establishes the minimum performance, test, and measurement requirements for plug-pigtail and plug-receptacle style OTDR (Optical Time-Domain Reflectometer) reflecting d…
IEC 61837-2:2018
ДействующийSurface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal le…
Overview IEC 61837-2:2018 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (Edition 3.0, 2018…
IEC 61851-23-1:2026
ДействующийElectric vehicle conductive charging system - Part 23-1: DC electric vehicle supply equipment - Automated con…
Overview IEC 61851-23-1:2026 is an international standard published by the International Electrotechnical Commission (IEC) that specifies requirements for DC electric vehicle supply equipment (EVSE)…
IEC 63506:2026
ДействующийCalibration of the prompt fission neutron logging tools
Overview IEC 63506:2026 - Calibration of the Prompt Fission Neutron Logging Tools is the international standard that specifies the calibration methods for prompt fission neutron (PFN) logging tools,…
IEC 63589-1:2026
ДействующийLinear accelerator - Electron linear accelerator for radiation processing - Part 1: General requirements and…
Overview IEC 63589-1:2026 specifies the general requirements and test methods for electron linear accelerator devices used in radiation processing. Developed by the International Electrotechnical Com…