IEC 60747-15:2024
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 176
- Дата публикации:
- 22 октября 2024 г.
- Издание:
- IEC IS 60747 edition 3 version 1
- ICS:
- 31.080.99
IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition: a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C); b) The thermal resistance is described for each switch (6.2.4); c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).
Abstract
Overview
IEC 60747-15:2024 - "Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices" defines requirements, ratings and test methods for isolated power semiconductor devices. It supplements the general device requirements in other parts of IEC 60747 and the IC-specific parts of IEC 60748. This third edition updates the standard to include intelligent power semiconductor modules (IPMs), clarifies thermal resistance measurement per switch, and adds an optional isolation test between temperature sensors and terminals.
Key topics and requirements
- Scope and ratings: Defines essential ratings and limiting values such as isolation voltage, terminal currents, peak case non‑rupture current, total power dissipation and temperature limits.
- Isolation requirements: Procedures for verification of isolation voltage (e.g., high-pot/isolation breakdown tests) including the new optional test between a temperature sensor and device terminals (clause 6.1.2).
- Thermal characteristics: Measurement and specification of thermal resistance for each switch and transient thermal impedance (clause 6.2.4 and related figures).
- Electrical parasitics and partial discharge: Measurement methods for parasitic inductance and capacitance, and partial discharge inception/extinction voltages.
- Mechanical and climatic ratings: Mechanical characteristics, parasitic parameter limits and environmental (climatic) ratings where applicable.
- Acceptance, endurance and reliability testing: Lists of endurance tests, acceptance criteria, plus required type and routine tests (tables and annexes provide test matrices).
- IPM-specific requirements: Annex C covers intelligent power semiconductor modules (IPMs) - control terminals, ratings, protection functions, and measurement circuits for control and protection features.
Applications and users
This standard is practical for:
- Semiconductor manufacturers designing and specifying isolated power discrete devices and modules.
- Test laboratories and QA teams performing acceptance, type and routine testing to ensure device isolation, thermal and reliability performance.
- Power electronics designers and systems engineers who select isolated power devices for converters, inverters, motor drives and safety‑critical applications where electrical isolation and thermal performance matter.
- Certification bodies and compliance engineers assessing conformity with international electrotechnical safety and performance expectations.
Related standards
- Other parts of IEC 60747 (general device requirements for non‑isolated power devices)
- Relevant parts of IEC 60748 (integrated circuit requirements)
- Use this document together with national/regional safety standards and product‑specific IEC standards when designing and certifying power electronic equipment.
Keywords: IEC 60747-15:2024, isolated power semiconductor devices, isolation voltage, thermal resistance, IPM, parasitic inductance, partial discharge, type tests.
Технические детали
- Технический комитет
- SC 47E - Discrete semiconductor devices
- SKU
- IEC 60747-15:2024
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