IEC 60748-22:1997

Overview

IEC 60748-22:1997 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies sectional requirements for film integrated circuits (FICs) and hybrid film integrated circuits (HICs). This standard focuses on the capability approval procedures used to assess the quality and reliability of these semiconductor integrated circuits, whether manufactured as catalogue items or custom-built solutions. It plays a crucial role in defining preferred ratings, characteristics, test methods, and general performance criteria to be used in detailed specifications.

The document reflects current technological practices as of its 1997 revision and provides a comprehensive framework for manufacturers and quality assurance bodies to ensure consistent performance and quality in film and hybrid film integrated circuits.

Key Topics

• Scope and Application
  The standard applies specifically to film and hybrid film integrated circuits, addressing their manufacturing processes and quality assessment based on capability approval procedures.

• Preferred Characteristics and Ratings
  IEC 60748-22 defines preferred values for electrical and environmental ratings, including limits for operating conditions and performance characteristics that should be considered in product specifications.

• Capability Approval Procedures
  Detailed procedures are outlined for capability approval, including:

  • Selection of Capability Qualifying Circuits (CQCs) that represent production quality.
  • Structural similarity models that guide acceptance criteria for related circuit designs.
  • Requirements for capability approval including test schedules and acceptance criteria (presented for both method A and method B).
  • Process for resubmission and inspection of rejected production lots.

• Test and Measurement Methods
  The standard prescribes specific environmental tests, measurement methods, and quality control tests designed to evaluate the durability and performance of film and hybrid film ICs during manufacturing and subsequent use.

• Manufacturer Capability Manuals
  Annexes provide the minimum required content for manufacturers’ capability manuals to document production processes for thick film and thin film integrated circuits.

Applications

IEC 60748-22:1997 is essential for:

• Manufacturers of Film and Hybrid Film Integrated Circuits
  Ensuring consistent quality through capability approval procedures facilitates trust in production processes and end products.

• Quality Assurance and Certification Bodies
  Using the standard enables uniform testing protocols and quality benchmarks necessary for international acceptance and market access.

• Design Engineers and System Integrators
  Incorporating the preferred characteristics, ratings, and approved test methods helps in specifying reliable film and hybrid film ICs that meet industry standards.

• Procurement and Supply Chain Management
  Evaluation against IEC 60748-22 supports selecting suppliers with proven manufacturing capabilities and adherence to quality assessments.

Related Standards

• IEC 60748 Series
  The overall series covers sectional specifications for various types of integrated circuits, providing complementary guidelines for different semiconductor technologies.

• IEC 47 Technical Committee Standards
  Other standards created by IEC subcommittee 47A focusing on integrated circuits and semiconductor device testing provide additional frameworks for semiconductor quality assessment.

• IEC 50: International Electrotechnical Vocabulary (IEV)
  Provides essential terminology used throughout IEC standards, including IEC 60748-22, ensuring clarity and consistency in technical language.

• IEC 27, 417, 617, and 878
  These standards define graphical symbols and letter symbols for electrotechnical use, relevant for documentation and schematics involving integrated circuits.

This standard is a critical resource for industries involved in the design, manufacturing, quality control, and application of film and hybrid film integrated circuits, offering a structured approach to capability approval that ensures high-quality semiconductor products in global markets.