IEC 60748-23-1:2002

Overview

IEC 60748-23-1:2002 is an International Electrotechnical Commission (IEC) generic specification for manufacturing line certification of high‑quality hybrid integrated circuits and film structures. The standard applies to hybrid integrated circuits (full or partly completed) that incorporate special customer quality and reliability requirements, and it provides a framework for documenting, qualifying and certifying production lines used to produce these semiconductor devices.

Key topics and requirements

The standard covers a broad set of technical and quality topics relevant to hybrid ICs and film structures, including:

• Definitions and normative references that establish vocabulary and mandatory cross‑references for certification activities.
• Manufacturing line certification process and generic specification scope for high‑quality hybrid integrated circuits (with films).
• Qualification and reliability testing guidance (environmental tests, electrical tests, burn‑in and life‑test procedures) to demonstrate product robustness.
• Mechanical and packaged device tests, inspection and acceptance criteria for parts, assemblies and film structures.
• Test and measurement procedures and sampling rules for production and qualification testing.
• Documentation and traceability requirements (drawn from the publication’s structure and references).
• Quality assessment and continual improvement processes for manufacturing lines, including guidance for supplier/customer interactions and line audits.
• Marking, product identification and delivery conditions for fully and partly completed devices.

The content emphasizes practical certification parameters rather than only product specifications - for example, methods for assessing production line capability and evidence required to confirm compliance with agreed quality and reliability levels.

Applications and practical value

IEC 60748-23-1 is intended to be used to:

• Certify a manufacturing line prior to or during production of high‑quality hybrid ICs and film‑based structures.
• Provide a common baseline for supplier–customer agreements where special reliability and quality needs exist.
• Guide quality engineers and test laboratories in establishing qualification test plans, sampling regimes and acceptance criteria.
• Support product audit, traceability and continual improvement programs for hybrid semiconductor manufacturing.

Using this standard helps reduce ambiguity in contractual quality expectations, improves reproducibility of qualification testing, and streamlines acceptance of partly completed devices supplied for further processing.

Who should use this standard

• Quality and reliability engineers in semiconductor and hybrid‑module manufacturers
• Production managers and process engineers responsible for manufacturing line certification
• Suppliers and customers needing a common certification basis for hybrid ICs and film structures
• Test laboratories and auditors performing qualification, environmental and electrical testing

Related standards

The publication references and aligns with other IEC documentation and catalog listings for electrical components and test methods. Users should consult accompanying IEC normative references and relevant part‑specific IEC standards for detailed test procedures and electrical specifications when implementing certification activities.

Keywords: IEC 60748-23-1, hybrid integrated circuits, manufacturing line certification, film structures, semiconductor quality, qualification testing, reliability testing, burn‑in, inspection, traceability.