IEC 60748-23-2:2002

Overview

IEC 60748-23-2:2002 - “Semiconductor devices - Integrated circuits - Part 23-2” defines requirements for manufacturing line certification, focusing on internal visual inspection and special tests for hybrid integrated circuits and film structures. The standard applies to high-quality approval systems for hybrid, multichip and multichip-module microcircuits and passive elements (including r.f./microwave). It is intended primarily for inspections performed prior to capping or encapsulation to detect internal non‑conformances that could cause field failures, and for sampling to verify manufacturer quality control.

Key Topics and Technical Requirements

• Scope and definitions tailored to hybrid ICs and thin/thick film structures.
• Inspection procedures covering sequence, control, re-inspection, exclusions and interpretation rules.
• Magnification guidance for various checks (examples shown in the standard: low magnification and ranges such as 3×–10×, 10×–60×, 30×–60×).
• Thin- and thick-film element inspection: metallization, passivation/glassivation, substrate defects, foreign material, resistors and laser-trimmed elements.
• Assembly and attachment checks: element mounting, solder joints, leaded/leadless components, lead-frame attachments, conformal coating and package conditions.
• Bond and internal lead inspection: ball/wedge/ribbon/mesh bonds, beam leads and wire loops with visual defect criteria.
• Special tests: radiographic inspection criteria and Particle Impact Noise Detection (PIND) test procedures, equipment and failure/lot acceptance rules.
• Use of class criteria (illustrated figures for Class H and Class K) to quantify allowable defects such as scratches, voids, cracks, trim kerfs and bridging.

Practical Applications

• Ensures internal workmanship and material integrity of hybrid ICs and film structures before encapsulation.
• Detects manufacturing defects that could degrade reliability in high-reliability sectors: aerospace, defense, medical devices, telecommunications and RF/microwave systems.
• Supports manufacturing line certification, supplier qualification, incoming inspection, and lot acceptance sampling programs.
• Aids failure analysis by standardizing internal visual criteria and linking to non‑destructive tests (radiography, PIND).

Who Should Use This Standard

• Quality engineers and inspectors at hybrid IC and passive component manufacturers.
• Process and reliability engineers responsible for encapsulation and assembly decisions.
• Procurement/supplier quality teams and auditors evaluating supplier manufacturing lines.
• Test labs performing internal visual, radiographic and PIND testing on microelectronic devices.

Related Standards

• Other parts of the IEC 60748 series (integrated circuits / semiconductor device guidance) and organizational detail specifications that reference manufacturing-line and inspection criteria.

Keywords: IEC 60748-23-2, hybrid integrated circuits, internal visual inspection, manufacturing line certification, film structures, PIND test, radiographic inspection, thin film resistor, laser trim, bonding inspection.