IEC 60749-20-1:2009

Overview

IEC 60749-20-1:2009 sets the international requirements for handling, packing, labeling, and shipping of non-hermetic surface-mount devices (SMDs) sensitive to both moisture and soldering heat. Published by the International Electrotechnical Commission (IEC), this standard ensures the integrity and reliability of SMDs during and after reflow soldering processes. It addresses the risks associated with moisture uptake in plastic-encapsulated semiconductors, specifically the potential for cracks and delamination caused by rapid moisture expansion at high temperatures.

By providing standardized methods for dry packing, labeling, and moisture control, the standard enables safe storage and transportation of moisture/reflow-sensitive SMDs, minimizing damage during printed circuit board (PCB) assembly and ensuring compliance with global quality expectations in electronics manufacturing.

Key Topics

• Scope of Coverage
  Applies to all non-hermetic SMD packages exposed to reflow soldering and ambient air. Hermetic packages are excluded.

• Moisture Sensitivity Classification
  Refers to moisture susceptibility levels as defined in IEC 60749-20, affecting how SMDs are handled before solder reflow.

• Dry Packing Requirements
  Describes packaging with a moisture barrier bag (MBB), desiccant, and humidity indicator card (HIC), ensuring interior humidity remains below damaging thresholds.

• Labeling Protocols
  Specifies use of moisture-sensitive identification (MSID) and caution labels, with barcoding requirements on shipping containers.

• Shelf Life and Storage
  Sets minimum 12-month shelf life for dry-packed SMDs stored below 40 °C and 90% relative humidity in non-condensing environments.

• Drying and Baking Guidelines
  Includes detailed conditions for drying SMDs and packaging materials to maintain safe humidity levels and avoid re-baking cycles.

• Shipping and Inspection
  Details practices for safe transit, incoming inspection, and criteria for bag opening and re-sealing without compromising device safety.

• Factory Floor Use
  Defines maximum allowable exposure times (“floor life”) after removing SMDs from dry packs, and outlines options for rework and reflow soldering processes.

Applications

IEC 60749-20-1:2009 is crucial in sectors where the reliability of SMDs underpins product safety and performance, including:

• Electronics Manufacturing
  Ensures minimal attrition and consistent quality in automated PCB assembly lines, especially when using reflow ovens or hot air rework.

• Component Distribution
  Guides distributors in repacking and shipping SMDs under controlled moisture levels to safeguard downstream processing.

• Quality Assurance and Reliability Testing
  Supports manufacturers and end-users in maintaining traceable, standardized procedures, reducing the risk of failures linked to moisture-induced package damage.

• Supply Chain Management
  Facilitates international movement of moisture-sensitive components by meeting universally recognized packaging and handling protocols.

Related Standards

• IEC 60749-20
  Classification of moisture/reflow sensitivity for non-hermetic SMDs.

• IEC 60749-30
  Requirements for preconditioning of non-hermetic surface mount devices prior to reliability testing.

• IPC/JEDEC J-STD-033
  Widely adopted guidelines for handling, packaging, shipping, and use of moisture/reflow sensitive SMDs.

• ESD Packaging Standards
  Requirements for packaging electrostatic discharge sensitive electronic components.

By adhering to IEC 60749-20-1:2009, manufacturers, assemblers, and distributors significantly improve the reliability of SMDs, optimize supply chain procedures, and comply with international best practices for moisture and soldering heat sensitive surface-mount devices.