IEC 60749-28:2022

Overview

IEC 60749-28:2022 is the international standard for device-level Charged Device Model (CDM) electrostatic discharge (ESD) sensitivity testing of semiconductor devices. It defines the field‑induced (FI) CDM test method (with a direct contact DC‑CDM alternative described in Annex J) to reliably reproduce CDM‑type failures and produce repeatable, comparable ESD sensitivity data across testers and laboratories. The scope covers packaged semiconductor devices, thin‑film circuits, SAW devices, opto‑electronic devices, hybrid integrated circuits (HICs) and multi‑chip modules (MCMs). Socketed discharge model testers are excluded.

Key topics and technical requirements

• Test purpose and scope: Procedures for testing, evaluating, and classifying device susceptibility to field‑induced CDM ESD.
• Required equipment: CDM ESD tester elements (current‑sensing element, ground plane, field plate and dielectric, charging resistor), waveform measurement hardware, verification modules (metal discs), capacitance meter and ohmmeter.
• Waveform capture & verification: Periodic tester qualification, quarterly and routine waveform verification, oscilloscope bandwidth considerations and waveform parameter recording.
• Test procedures: Device handling and preparation, test temperature and humidity requirements, charge delays for full charging, single/dual discharge procedures, and recording/reporting guidelines.
• Classification: Criteria and reporting format to classify ESDS (ESD sensitive) devices based on CDM test results.
• Special cases: New provisions for CDM testing of very small package integrated circuits and discrete semiconductors (Annex C) and clarified cleaning procedures for devices and testers.
• Alternatives & annexes: Annex J describes the direct contact (DC‑CDM) method; informative annexes provide hardware schematics, sample waveforms, and metrology guidance.

Practical applications

• Classifying semiconductor components for ESD robustness and supplier datasheet ratings.
• Reproducing CDM failure modes during qualification, reliability testing and failure analysis.
• Verifying and qualifying CDM test equipment and laboratory procedures to ensure consistent inter‑lab comparisons.
• Guiding ESD protection design and process controls in assembly/test environments to reduce field‑induced CDM failures.

Who should use this standard

• Semiconductor manufacturers and device test engineers
• Reliability and quality assurance teams at OEMs and EMS providers
• ESD test laboratories and accredited testing services
• Test equipment manufacturers and metrology specialists
• Failure analysis and reliability research groups

Related standards

• Part of the IEC 60749 series (mechanical and climatic test methods) and complements other ESD models and test approaches (field‑induced CDM vs direct contact CDM). For complete test program alignment, consult other IEC 60749 parts and applicable ESD test standards used in your supply chain.