IEC 60749-39:2006

Overview

IEC 60749-39:2006 is an international standard published by the International Electrotechnical Commission (IEC) focusing on semiconductor devices. Specifically, it addresses mechanical and climatic test methods, with Part 39 dedicated to the measurement of moisture diffusivity and water solubility in organic materials used for semiconductor packaging.

This part of the IEC 60749 series outlines detailed procedures to assess two vital material properties – moisture diffusivity and water solubility – in organic encapsulants commonly employed in plastic-packaged semiconductors. These parameters play a critical role in evaluating the reliability performance of semiconductor components after moisture exposure and high-temperature solder reflow processes. Understanding these characteristics is fundamental to the durability and effective functioning of plastic-packaged semiconductor devices in humid or thermally demanding environments.

Key Topics

• Scope and Application: The standard applies to organic materials used in semiconductor packaging, focusing on how moisture permeates and dissolves in these materials, which affects semiconductor reliability.

• Test Apparatus and Samples: IEC 60749-39 details the necessary apparatus for conducting moisture absorption and desorption tests and specifies sample preparation protocols to ensure consistency and repeatability.

• Measurement Procedures:

  • Moisture Absorption Below 100 °C: Procedures for measuring how the organic materials absorb moisture at temperatures below 100 °C.
  • Desorption Above 100 °C: Methods for measuring moisture release from materials at elevated temperatures.
  • Calculation Methods: Step-by-step instructions to calculate moisture diffusivity, water solubility, and activation energy for moisture diffusion based on test data.

• Reliability Implications: The data gathered via these procedures inform manufacturers and engineers about the behavior of semiconductor encapsulants under real-life conditions, particularly after moisture exposure and solder reflow cycles.

• Standard Maintenance: The IEC monitors and updates the standard to reflect technological advances, ensuring it remains relevant for current semiconductor manufacturing practices.

Applications

IEC 60749-39 serves as an essential tool for:

• Semiconductor Manufacturers: To select and qualify organic packaging materials that meet moisture resistance requirements, reducing device failures caused by moisture ingress.

• Quality Control Laboratories: For routine testing of material batches to verify compliance with moisture diffusivity and solubility criteria.

• Reliability Engineers: To simulate environmental conditions impacting semiconductor packaging and evaluate potential failure mechanisms related to moisture.

• Material Scientists: To study and develop improved organic materials with optimized moisture barrier properties, enhancing semiconductor device lifespan.

• Solder Reflow Process Optimization: By understanding moisture characteristics, process parameters can be adjusted to minimize moisture-related defects during assembly.

Related Standards

• IEC 60749 Series: This part is one within a comprehensive suite of standards covering mechanical and climatic test methods for semiconductor devices. Other parts address mechanical stress tests, thermal cycling, humidity tests, and other environmental evaluations.

• IPC/JEDEC Standards: Industry-specific standards for semiconductor packaging reliability that complement the moisture measurement procedures by focusing on broader qualification methods.

• ISO/IEC Directives: Governing guidelines for drafting and maintaining IEC standards, ensuring consistency and transparency in international standardization efforts.

Summary

IEC 60749-39:2006 provides a standardized method to measure essential moisture-related properties in organic materials used for semiconductor packaging. By delivering precise, reproducible methods to quantify moisture diffusivity and water solubility, this standard supports enhanced semiconductor reliability in humid and high-temperature environments. Whether you are a semiconductor manufacturer, materials engineer, or quality assurance professional, compliance with IEC 60749-39 enables better design choices, testing rigor, and product durability – key factors in today’s high-performance electronic markets.

Keywords: IEC 60749-39, moisture diffusivity, water solubility, semiconductor packaging, organic materials, mechanical and climatic tests, plastic packaged semiconductors, reliability performance, solder reflow, moisture measurement, semiconductor standards.