IEC 61076-4-115:2003

Overview

IEC 61076-4-115:2003 is an international standard issued by the International Electrotechnical Commission (IEC) that specifies requirements for printed board connectors, specifically backplane connectors designed for InfiniBand electronic equipment. This standard details a single-part hybrid connector optimized for high-speed and low-speed connections on printed boards and backplanes, aligning with IEC 60917-2-2 guidelines. It establishes the dimensional, mechanical, electrical, and environmental characteristics essential for reliable InfiniBand system interconnects.

This connector standard combines high-speed data transmission capabilities on a 3 mm grid section and accommodates lower-speed signal, power, and ground terminals on a 2 mm grid. Its focus on hybrid design addresses the increasing demand for compact, high-performance, and power-efficient interconnections in electronic communication infrastructure.

Key Topics

• Connector Design and Configuration
  The standard specifies a hybrid backplane connector with two distinct contact sections:

  • High-speed signal contacts arranged on a 3 mm pitch grid for optimized differential signaling.
  • Low-speed contacts supporting power and grounding on a 2 mm pitch grid.

• Mechanical and Dimensional Specifications

  • Details dimensional tolerances and mating parameters to ensure reliable insertion force and secure mechanical coupling.
  • Defines mounting methods consistent with recommended installation practices for backplane integration.
  • Includes illustrated guidance for gauge measurements and mounting safeguards such as paddle-guards.

• Electrical and High-Speed Performance

  • Ratings for current, voltage, and signal integrity conform to InfiniBand equipment requirements.
  • Characterization of impedance and crosstalk to maintain signal quality at high data rates.
  • Defines test methods for confirming electrical performance including differential pair handling.

• Environmental and Durability Aspects

  • Climatic category and dust/fibre resistance to ensure operability under various environmental conditions.
  • Mechanical endurance tests for mating cycles and insertion/extraction forces to guarantee long-term reliability.

• Testing and Compliance

  • Extensive test schedules covering mechanical, electrical, and environmental assessments.
  • Supplementary annexes specify test methods for gauge supporting force and contamination resistance.

Applications

IEC 61076-4-115 connectors are crucial in advanced electronic systems requiring high bandwidth and reliable data exchange, such as:

• InfiniBand Network Equipment
  • Used in high-performance computing clusters and data centers where low latency and high throughput connections are critical.
• Telecommunications Backplanes
  • Facilitate modular system design with combined power and signal connectivity for telecom infrastructure.
• Server and Storage Systems
  • Provide robust backplane interfaces supporting mixed signal and power requirements for server modules.
• Embedded Systems
  • Employed in printed circuit boards necessitating compact connectors that handle diverse signal types.

This standard ensures interoperability, enhanced data transmission performance, and mechanical robustness of connectors used in these demanding environments.

Related Standards

• IEC 60917-2-2
  • Offers established guidelines for printed board connector mounting, which IEC 61076-4-115 references for installation practices.
• IEC 61076 Series
  • Covers various types of connectors for electronic equipment, providing a comprehensive framework for connector design and usage.
• InfiniBand Trade Association Specifications
  • Define the system-level electrical and protocol requirements that these connectors are designed to support.

By adhering to IEC 61076-4-115, manufacturers and system integrators ensure consistent quality, performance, and compatibility, supporting the efficient deployment of InfiniBand and high-speed backplane systems worldwide.

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