IEC 61190-1-2:2014

Overview

IEC 61190-1-2:2014 is an international standard developed by the International Electrotechnical Commission (IEC), focusing on the requirements for soldering pastes used in electronics assembly. Specifically, this standard sets general requirements for characterization and testing of solder pastes intended for creating high-quality electronic interconnections. It serves as a quality control guideline, ensuring consistent material specifications, but does not directly address manufacturing process performance.

The 2014 edition (Edition 3.0) introduces key updates such as revised solder powder size classifications, detailed guidance on reflow conditions and profiles, and additional annexes comparing particle size measurement methods. This standard applies globally and assists manufacturers, suppliers, and quality engineers in maintaining reliable and trusted solder paste quality for electronic assemblies.

Key Topics

• Solder Paste Characterization: Defines measurement methods and test procedures for:

  • Alloy composition
  • Flux properties and shelf life
  • Solder powder particle size and shape
  • Viscosity and slump tests
  • Tackiness and wetting ability
  • Solder ball formation as a defect indicator

• Standardized Product Description: Provides structured terminology and classification for solder paste types to facilitate clearer communication among manufacturers and users.

• Quality Assurance: Outlines responsibilities for inspection, sampling plans for qualification and acceptance, and requirements for test equipment and reporting to ensure consistent product quality.

• Technical Updates:

  • Revised solder powder size specifications (see Table 2 in the standard)
  • Inclusion of Annex B covering recommended reflow conditions and thermal profiles to optimize soldering outcomes
  • Addition of Annex C that compares laser diffraction and screen methods for particle size measurement

Applications

IEC 61190-1-2:2014 is essential for industries involved in manufacturing and assembly of electronic devices where reliability of interconnects is critical. Practical applications include:

• Electronics Manufacturing: Ensuring solder pastes meet stringent quality requirements for producing PCB assemblies with high interconnect integrity.

• Component Assembly: Aiding process engineers in selecting and verifying solder paste materials that comply with international norms for flux activity, particle size, and viscosity.

• Quality Control Laboratories: Providing comprehensive test methodologies to assess solder paste characteristics for acceptance or rejection before use.

• Supplier Certification: Assisting solder paste suppliers to certify their products against recognized benchmarks, facilitating global market acceptance.

• R&D and Process Optimization: Supplying foundational data for developing new solder paste formulations or adjusting reflow profiles to enhance assembly reliability.

Related Standards

IEC 61190-1-2:2014 is part of the broader IEC 61190 series on attachment materials for electronic assembly. Related standards in this series cover other types of soldering materials and attachment technologies, including:

• IEC 61190-1-1 – Requirements for soldering fluxes
• IEC 61190-1-3 – Specifications for solid solder alloys in electronics
• IEC 61190-2 – Assembly techniques and soldering processes

Additionally, this standard references companion documents and normative publications on test methods, safety, and environmental considerations relevant to electronics assembly materials.

By adhering to IEC 61190-1-2:2014, manufacturers, assemblers, and quality assurance teams can ensure the use of high-quality soldering pastes that meet international requirements, resulting in better reliability, performance, and longevity of electronic assemblies worldwide.