IEC 61249-2-47:2018

Overview

IEC 61249-2-47:2018 is an international standard that specifies material and performance requirements for non‑halogenated epoxide non‑woven/woven E‑glass reinforced laminate sheets, copper‑clad and intended for lead‑free assembly. It applies to laminates with nominal thicknesses from 0.60 mm to 1.70 mm, a defined thermal conductivity of (2.0 ± 0.30) W/(m·K), and a minimum glass transition temperature (Tg) of 105 °C. The standard defines flammability using the vertical burning test, where the required flame retardancy is achieved by non‑halogenated fire retardants chemically reacted into the epoxy polymeric matrix.

Key topics and technical requirements

IEC 61249-2-47:2018 covers both material composition and measurable properties, including:

• Materials and construction
  • Non‑halogenated epoxide resin systems
  • Non‑woven core and woven E‑glass surface reinforcements
  • Copper foil specifications for copper‑clad sheets
• Thermal performance
  • Thermal conductivity requirement: 2.0 W/(m·K) ± 0.30
  • Minimum Tg = 105 °C
• Flammability
  • Defined performance in the vertical burning test with non‑halogenated flame retardants
• Mechanical and physical properties
  • Flexural strength, measling, decomposition temperature, time to delamination (TMA)
  • Water absorption limits and dimensional stability
• Copper bond and processing
  • Pull‑off and peel strength requirements, punching/machining suitability
• Electrical properties
  • Specified in tabulated limits for the copper‑clad laminate
• Quality assurance and documentation
  • Qualification and conformance inspection, certificate of conformance, safety data sheet, packaging and marking, and ordering information

Practical applications - who uses this standard

This standard is relevant to organizations and professionals involved in the specification, manufacture and procurement of printed circuit board (PCB) base materials where enhanced thermal performance and lead‑free assembly compatibility are required:

• PCB material suppliers and laminators
• Electronic OEMs and contract manufacturers selecting base laminates for thermal management
• Design engineers specifying materials for boards with elevated power density
• Quality, compliance and procurement teams requiring standardized material acceptance criteria

IEC 61249-2-47 supports reliable heat dissipation, defined flammability behavior, and consistent mechanical/electrical performance for copper‑clad laminates used in lead‑free manufacturing processes.

Related standards

• Other parts of the IEC 61249 series (Materials for printed boards and other interconnecting structures) provide complementary requirements for different laminate types and constructions. Check the IEC webstore for the complete list and applicable normative references cited in IEC 61249-2-47:2018.