IEC 61760-2:2007

Overview

IEC 61760-2:2007 - Surface mounting technology Part 2 - is an application guide that defines recommended transportation and storage conditions for surface mounting devices (SMDs). Its objective is to ensure SMDs (active and passive) are received, stored and handled so they remain processable (positioning, soldering) without loss of quality or reliability. The standard helps prevent assembly failures such as poor solderability, delamination and “popcorning” caused by improper shipping or warehousing.

Key topics and requirements

• Climatic conditions (transportation):
  • General requirement: follow IEC 60721-3-2 class 2K2 (with specific exceptions noted in the standard).
  • Examples from the text: low air temperature down to –40 °C, temperature change ranges (air/air −40 °C / +30 °C), and low air pressure down to 30 kPa.
  • Preferred transport method: air transport with conditioned cargo (Category 1, IEC 60721-3-2 class 2K1); unconditioned rail/road transport allowed only for robust parts.
  • Recommended: total uncontrolled transportation time preferably not exceed 10 days.
• Mechanical protection during transport:
  • Follow IEC 60721-3-2 class 2M1 mechanical limits; packaging must prevent deformation and avoid transmitting forces to inner packaging.
• Storage conditions:
  • Recommended storage climate: IEC 60721-3-1 class 1K2 (with limits: relative humidity ~10–75 % as advised).
  • Storage time: do not exceed manufacturer’s specified shelf life; recommended total storage ≤ 2 years and preferably ≤ 1 year after customer receipt. If exceeded, re‑qualification (at minimum solderability) is required.
  • Keep original smallest packaging unit (SPU) sealed; avoid harmful gases, direct solar radiation, and strong electrical fields.
• Packaging and handling:
  • Use packaging consistent with IEC 60286 series (tape, stick magazines, trays, bulk case) to protect against mechanical, environmental and electrostatic damage.
• Requalification and ESD:
  • If conditions deviate, follow IEC 60749 tests and IEC/TS 61340-5-x guidance for ESD protection and component requalification.

Applications - who uses IEC 61760-2

• Component manufacturers and packagers (define shipping specs)
• Distributors and logistics providers (set handling and transport controls)
• PCB assembly houses and electronics manufacturers (incoming inspection, storage, shelf‑life rules)
• Quality, procurement and supply‑chain engineers (supplier contracts, risk mitigation)
• Test and reliability engineers (re‑qualification planning)

Related standards

• IEC 60286 (packaging for automatic handling: tapes, trays, magazines)
• IEC 60721-3-1 / IEC 60721-3-2 (classification of environmental conditions for storage and transportation)
• IEC 60749 (mechanical and climatic test methods)
• IEC/TS 61340-5-1 and 61340-5-2 (electrostatics protection)

Keywords: IEC 61760-2, surface mounting technology, SMD storage, SMD transportation, solderability, popcorning, packaging IEC 60286, IEC 60721, ESD protection.