IEC 62047-13:2012

Overview

IEC 62047-13:2012 is an international standard published by the International Electrotechnical Commission (IEC) that defines standardized test methods for measuring the adhesive strength of micro-electromechanical system (MEMS) structures. Specifically, this standard covers bend- and shear-type test methods to evaluate the adhesion between micro-sized elements and their substrates. The adhesive testing methods apply to columnar test specimens with dimensions ranging from 1 micrometer up to 1 millimeter in width and thickness. Designed to support material selection and processing optimization, IEC 62047-13:2012 is essential for manufacturers and researchers developing MEMS devices where interfacial adhesion critically impacts performance and reliability.

Key Topics

• Adhesive Strength Measurement: Defines bend-type and shear-type test procedures to quantify the adhesive strength between MEMS microstructures and substrates.
• Test Specimens: Focuses on columnar-shaped micro-sized elements with widths and thicknesses between 1 µm and 1 mm, fabricated via deposition, plating, and photolithography.
• Bend-Type Test: Involves applying a bending force to a micro-column using a knife-edged loading tool with a tapered tip at a controlled angle (10° to 20°) to minimize compression effects.
• Shear-Type Test: Applies shear force parallel to the cylindrical column lateral face using precise alignment of the loading tool with angle errors kept between 0° and 15°. The apex of the knife edge may be slanted to reduce bending stresses.
• Test Equipment Requirements: Considers actuators, force measurement sensors, alignment systems, and data recorders suitable for micro-scale testing without restricting test piece materials or dimensions.
• Data Analysis: Provides procedures for analyzing force at delamination to determine nominal adhesive bend and shear strengths.
• Test Conditions: Covers gripping methods, test speed, environmental factors, and alignment considerations essential to ensure repeatable and accurate measurements.
• Scope and Flexibility: Acknowledges the diversity of MEMS device materials and sizes, recommending adaptable testing setups rather than fixed equipment specifications.

Applications

IEC 62047-13:2012 is widely applicable in:

• MEMS Device Fabrication: Ensures reliable adhesion at interfaces between thin films and substrates, helping to avoid delamination during production or operation.
• Material Selection: Provides standardized metrics to compare materials and adhesive interfaces used in MEMS microstructures.
• Process Optimization: Helps in refining deposition, plating, and photolithography processes by evaluating their impact on adhesive strength.
• Quality Control: Facilitates consistent, repeatable testing to verify adhesive performance during manufacturing.
• Research and Development: Supports the innovation of new MEMS devices with complex material interfaces by providing reliable adhesion characterization techniques.

The standard's ability to measure adhesive strength at micro-scales between 1 µm and 1 mm aligns perfectly with the precision requirements of modern MEMS technologies and semiconductor device manufacturing.

Related Standards

To complement IEC 62047-13:2012, consider referencing these related standards:

• IEC 62047-2:2006 – Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials, which specifies tensile test procedures for MEMS thin films.
• Other Parts of IEC 62047 Series – Cover additional mechanical property testing methods relevant to semiconductor and MEMS devices.
• ISO/IEC Directives Part 2 – Provides rules for drafting international standards ensuring harmonized documentation.

Engaging with these standards creates a comprehensive framework for assessing the mechanical integrity of MEMS components, promoting reliability and innovation within the semiconductor industry.

Keywords: IEC 62047-13, adhesive strength, bend-type test, shear-type test, MEMS structures, micro-electromechanical devices, micro-scale testing, semiconductor devices, test methods, columnar specimens, material adhesion, interface delamination, testing equipment, force measurement, microstructure adhesion, standardization, semiconductor manufacturing.