IEC 62047-18:2013

Overview

IEC 62047-18:2013 is an international standard published by the International Electrotechnical Commission (IEC) that specifies bend testing methods for thin film materials used in micro-electromechanical systems (MEMS) and micromachines. This standard applies to thin films with dimensions under 1 mm in length and width, and thickness ranging from 0.1 µm to 10 µm. The document establishes precise procedures for testing micro-sized cantilever-type test pieces to ensure reliable and accurate mechanical property evaluation of thin films used as primary structural materials in semiconductor devices.

Key Topics

• Scope and Application

  • Focuses on thin films with micro-scale dimensions commonly used in MEMS and micromachine devices.
  • Defines bend testing methods for films with thickness from 0.1 to 10 micrometres.
  • Emphasizes the use of smooth cantilever-type test pieces to accurately assess mechanical properties.

• Test Piece Design and Preparation

  • Test pieces are shaped as cantilever beams with simple cross-sections (rectangular or trapezoidal) to facilitate calculation of moment of inertia.
  • Recommended size ratios: the length (L), width (W), and thickness (S) should maintain ratios 10 > L/W > 5 and 100 > L/S > 10.
  • Test pieces must be fabricated with the same processes used in actual device manufacturing, including deposition and photolithography.
  • Accurate measurement of width and thickness is essential-tolerances ±1% for width and ±5% for thickness.

• Testing Methods

  • Utilizes loading tools such as sphere-shaped or knife-edge shaped indenters to apply bend tests at defined points (A, B, or C) along the cantilever beam.
  • Force-displacement relationships are recorded to analyze elastic modulus and mechanical behavior.
  • Loading point positions, orientation of loading tools, and displacement measurements must adhere to strict accuracy requirements (±1% length accuracy for loading position, and specific tip radius and angular tolerances for knife-edge tools).
  • Test environment, speed of testing, and mounting methods are defined to ensure consistency and reproducibility.

• Data Analysis and Reporting

  • Emphasizes precise calculation of elastic modulus (E) using collected force (P) and displacement (δ) data.
  • Test reports must include detailed test piece dimensions, loading parameters, environmental conditions, and measured results.
  • Provides guidance on minimizing stress concentration effects at the test piece-substrate interface to avoid damage during testing.

Applications

IEC 62047-18:2013 is vital for industries and researchers involved in:

• Development and reliability testing of MEMS and micromachines that use thin film materials.
• Semiconductor manufacturing where mechanical properties of micro-scale thin films impact device performance.
• Quality control laboratories assessing thin film durability, flexibility, and elastic properties.
• Material science studies focusing on micro-electromechanical device components.

By standardizing bend testing methods, this IEC standard helps ensure consistent and comparable mechanical characterization of thin films across laboratories and industries worldwide, supporting innovation and quality in micro-device fabrication.

Related Standards

• IEC 62047-6:2009: Semiconductor devices – Micro-electromechanical devices – Part 6: Axial fatigue testing methods of thin film materials – complements Part 18 by providing axial fatigue testing methodologies.
• Other parts of the IEC 62047 series, which cover various mechanical and electrical tests for MEMS devices and semiconductor thin film materials.

Together, these standards provide comprehensive guidance on testing and characterization methods critical for ensuring the mechanical integrity and performance of micro-electromechanical semiconductor components.

Keywords: IEC 62047-18, bend testing methods, thin film materials, micro-electromechanical systems, MEMS testing standards, semiconductor device standards, cantilever beam test piece, thin film mechanical properties, micro-scale bend testing, elastic modulus measurement, microfabrication testing protocols.