IEC 62047-33:2019
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 24
- Дата публикации:
- 5 апреля 2019 г.
- Издание:
- IEC IS 62047 edition 1 version 1
- ICS:
- 31.080.99
IEC 62047-33:2019 (E) defines terms, definitions, essential ratings and characteristics, as well as test methods applicable to MEMS piezoresistive pressure-sensitive device. This document applies to piezoresistive pressure-sensitive devices for automotive, medical treatment, electronic products.
Abstract
Overview
IEC 62047-33:2019 - "Semiconductor devices - Micro‑electromechanical devices - Part 33: MEMS piezoresistive pressure‑sensitive device" - specifies terms, essential ratings and characteristics, and test methods applicable to MEMS piezoresistive pressure‑sensitive devices. The standard targets devices that convert pressure into electrical signals via the piezoresistive effect (typically a cavity‑membrane silicon structure with an integrated Wheatstone bridge). It applies to pressure sensors used in automotive, medical treatment, and other electronic products.
Key Topics
The standard defines or requires:
- Terms and definitions specific to MEMS piezoresistive pressure sensors (aligned with IEC 60747‑14‑3).
- Essential ratings and characteristics:
- Limiting values (ratings), recommended operating conditions, and device characteristics.
- A summary table of device characteristics as a reference.
- Comprehensive test methods, covering electrical, static, dynamic and environmental performance:
- Electrical tests: input/output resistance, leakage current, breakdown and isolation voltages.
- Static performance: zero output, full‑span output, sensitivity, nonlinearity, hysteresis, repeatability, accuracy, zero drift.
- Stability and long‑term tests: zero and sensitivity stability.
- Temperature influence: thermal zero drift, thermal sensitivity drift and thermal hysteresis.
- Dynamic performance: frequency response, resonant/ ringing frequency, damping ratio, rise time and overshoot.
- Environmental tests: high/low temperature storage, temperature cycling, vibration, mechanical shock, acceleration, moisture (HAST), mould growth, salt atmosphere, EMC and pressure extremes.
- Test setups and figures: example circuit connections for P‑N isolation and insulating medium devices, and recommended test system diagrams.
Applications and Who Uses It
IEC 62047‑33:2019 is practical for:
- MEMS pressure sensor manufacturers - for product specification, design verification and QA.
- Test laboratories and device integrators - to perform standardized electrical, mechanical and environmental qualification.
- Automotive and medical device developers - to select sensors meeting required stability, accuracy and environmental robustness.
- Procurement and regulatory teams - to define conformance criteria for supplier evaluation.
Keywords: MEMS piezoresistive pressure‑sensitive device, IEC 62047‑33:2019, pressure sensor test methods, piezoresistive sensor ratings, sensor stability, automotive pressure sensors, medical pressure sensors.
Related Standards
- IEC 60747‑14‑3 (Semiconductor sensors - Pressure sensors)
- IEC 60068 series (Environmental testing)
- IEC 60749 series (Mechanical and climatic test methods for semiconductor devices)
- IEC TR 61000‑4‑1 (EMC testing overview)
Технические детали
- Технический комитет
- SC 47F - Micro-electromechanical systems
- SKU
- IEC 62047-33:2019
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