IEC 62769-4:2021
Field Device Integration (FDI) - Part 4: FDI Packages
Field Device Integration (FDI) - Part 4: FDI Packages
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 248
- Дата публикации:
- 5 февраля 2021 г.
- Издание:
- IEC IS 62769 edition 2 version 1
- ICS:
- 25.040.40
IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
Abstract
Overview
IEC 62769-4:2021 - Field Device Integration (FDI) Part 4: FDI Packages defines the model, contents and lifecycle rules for FDI Packages used to deliver device descriptions, communication profiles and user interface plug‑ins for automation devices. The standard specifies which architectural components of the overall FDI architecture are in scope and how packages are structured, versioned, signed and deployed to FDI Hosts.
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