IEC 62769-8:2023
Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 105
- Дата публикации:
- 5 апреля 2023 г.
- Издание:
- IEC IS 62769 edition 1 version 1
- ICS:
- 33.040.40
IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Abstract
IEC 62769-8:2023 Overview
IEC 62769-8:2023, titled Field Device Integration (FDI®) - Part 8: EDD to OPC-UA Mapping, is an international standard published by the International Electrotechnical Commission (IEC). This standard defines the method for transforming the internal device model, represented through Electronic Device Description (EDD), into an external OPC Unified Architecture (OPC-UA) information model. By mapping EDD constructs to OPC-UA objects, this standard enables seamless integration and communication between field devices and industrial automation systems.
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