Overview
IEC 62878-1:2019 - "Device embedding assembly technology - Part 1: Generic specification for device embedded substrates" is the generic international standard that defines common requirements, terminology and test methods for device-embedded substrates fabricated with organic base materials. It covers substrates with discrete active and/or passive devices embedded into one or more inner layers and establishes a common baseline for design, testing, manufacturing interfaces and value‑chain responsibilities. The series explicitly excludes redistribution layers (RDL) and electronic modules as defined in IEC 62421.
Key topics and technical requirements
This generic specification addresses the main subjects common to device‑embedded substrates, including:
- Scope and terminology - unified definitions for embedded devices, substrates and related elements.
- Value chain and traceability - roles and interfaces for system designers, component and material manufacturers, submodule, board and assembly manufacturers.
- Design and structure - layer description rules, design for embedding and testability, and safety aspects of design.
- Embedding technology - basic embedding methods and essential process requirements such as cleanliness, ESD control and moisture sensitivity management.
- Tests and measurement methods - electrical performance, mechanical tests (shock, vibration, robustness of terminations), solderability and resistance to soldering heat, and climatic tests (dry heat, cold, damp heat, change of temperature). Many test references link to the IEC 60068 environmental test series and the basic printed board test methods in IEC 61189-3.
- Transportation, handling and packaging - humidity/temperature protection, mechanical protection and ESD precautions.
- General requirements - overall quality, sampling and acceptance practices are defined at the generic level; more specific test severities and acceptance criteria are covered in sectional/detail specifications (IEC 62878-3-x) and supporting guidelines (IEC 62878-2-x).
Applications and who should use it
IEC 62878-1 is intended for organizations involved in the design, manufacture, testing and procurement of electronic substrates that incorporate embedded discrete devices, including:
- PCB and substrate designers and manufacturers
- Component and material suppliers (organic base materials, conductive pastes, via technologies)
- Electronic assembly houses and contract manufacturers employing embedding processes
- Test laboratories and reliability engineers conducting electrical, mechanical and climatic qualification
- Procurement, quality and regulatory teams requiring standardized acceptance tests and traceability
Practical uses include guidance for embedding active/passive components into inner layers to enable higher density, improved reliability and form‑factor reduction for advanced electronic assemblies.
Related standards
- IEC 61189-3 - basic test methods for printed board substrate materials and substrates
- IEC 60068 series - environmental testing (e.g., cold, dry heat, vibration, change of temperature)
- IEC 62421 - electronic modules (explicitly excluded from IEC 62878 scope)
- IEC 62878 series - sectional (3‑x) and guideline/supporting documents (2‑x) that supplement this generic specification
Keywords: IEC 62878-1, device embedding, device-embedded substrates, embedded components, embedding technology, test methods, electronic substrate design, PCB embedding.