IEC 62878-2-602:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 24
- Дата публикации:
- 22 июня 2021 г.
- Издание:
- IEC IS 62878 edition 1 version 1
- ICS:
- 31.180
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Abstract
Overview
IEC 62878-2-602:2021 is an international standard that provides . Published by the International Electrotechnical Commission (IEC), this part of the device embedding assembly technology series addresses critical requirements to ensure reliable inter-module electrical connections in stacked 3D electronic assemblies. The standard is applicable to a wide range of electronic products where vertical stacking of modules is used to save space and enhance functionality, including high-end servers, network systems, and IoT devices.
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