IEC 62899-202-9:2023
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 14
- Дата публикации:
- 3 августа 2023 г.
- Издание:
- IEC IS 62899 edition 1 version 1
- ICS:
- 31.180
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
Abstract
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