IEC 62899-301-2:2017

Overview

IEC 62899-301-2:2017 - "Printed electronics - Part 301‑2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension" - defines standardized measurement terms and methods for assessing the critical dimensions and registration accuracy of features on rigid plate masters used in contact printing for printed electronics. The standard establishes a coordinate system, measurement instruments and algorithms, specification of registration marks, and reporting formats to support consistent metrology across device manufacturers, printing‑master suppliers and equipment vendors.

Key technical topics and requirements

• Measurement terminology and coordinate system: Defines terms and the coordinate reference used for plate master measurements.
• 1‑D qualification features: Procedures for measuring feature width, pitch, line edge roughness (LER) and line width roughness (LWR), including edge‑detection and reporting practices.
• 2‑D qualification features: Methods for assessing holes/dots (contacts), corner rounding, and line‑end shortening; image alignment and feature extraction techniques are specified.
• Cross‑sectional qualification: Methods to measure cross‑sectional area and feature height (3‑D height distribution and height profiles) and how to model trapezoidal features for area/height reporting.
• Registration accuracy: Specification of registration marks (cross and round forms with dimensional guidelines), algorithms for calculating feature positions from images, measurement procedure and recommended reporting formats.
• Metrology and reporting: Describes suitable measurement instruments, common metrology procedures, and example reports to ensure repeatable, auditable results.

Practical applications and users

The standard is intended for:

• Device manufacturers who require validated plate masters to achieve target resolution and registration for printed electronic components.
• Printing‑master manufacturers who produce rigid plate masters and need to certify pattern dimensions and mark placement.
• Equipment vendors that design and qualify contact printing and master‑manufacturing systems.
• Metrology labs and QA teams using standardized procedures for acceptance testing, process control and supplier audits.

Practical benefits include improved quality control, predictable transfer of fine features (<20 µm scale applications), consistent registration between layers, and clearer communication of acceptance criteria between buyers and suppliers.

Related standards

• Part of the IEC 62899 series on printed electronics; users should consult other parts of IEC 62899 for complementary guidance on processes, equipment types and flexible masters. For the latest editions and normative references, consult the IEC webstore or IEC technical committee TC 119 publications.