Overview
IEC TR 62258-8:2008 - "Semiconductor die products - Part 8: EXPRESS model schema for data exchange" provides an EXPRESS schema for structured electronic exchange of die-product information. Intended to facilitate production, supply and use of semiconductor die products (wafers, singulated bare die, die/wafers with connection structures, and minimally/partially encapsulated die), the Technical Report defines a STEP-based exchange mechanism that supports procurement, design, simulation and manufacturing workflows.
Key topics and technical requirements
- EXPRESS model schema (Annex A): A full EXPRESS listing (ddx_schema) describing types, entities and file structures (e.g., ddx_file, device_block, device) used to represent die product data.
- STEP Physical File (SPF) support: The schema is designed to be encoded as ISO 10303-21 SPF files and follows ISO 10303-11 EXPRESS rules - enabling interoperable product-data exchange.
- DDX format implementation: Implements entities defined in IEC 62258-2 (DDX exchange format) and extends them to include richer organizational, contact and subdivided data elements for clarity.
- Simulation and analysis data: Schema supports information needed for electrical (IEC 62258-5) and thermal (IEC 62258-6) simulation requirements, enabling consistent exchange of simulation models and related metadata.
- Examples and usage guidance: Annex B provides a STEP Physical File example; the report notes potential conversion from IEC 62258-4 questionnaire spreadsheets and the availability of commercial STEP tools.
- Data governance: The standard clarifies that suppliers are not obliged to publish proprietary data - such information may be exchanged under NDAs. Copyright and use terms for the electronic schema are stated.
Practical applications
- Standardized electronic transfer of die specifications between die manufacturers, suppliers, OEMs, and EMS providers.
- Exchange of data for EDA/CAD tools, simulation packages (thermal/electrical), and automated assembly/test systems.
- Supporting procurement, traceability, quality & reliability reporting, and compliance with die-product requirements during design and manufacturing.
- Enabling supply-chain interoperability by providing a machine-readable schema for die geometry, materials, terminals, wafer data and organization/contact details.
Who should use it
- Semiconductor die manufacturers and suppliers
- Package and test houses, electronics manufacturers (OEMs) and contract manufacturers
- EDA/EDA tool vendors, data integrators and PLM/ERP system integrators
- Simulation engineers (thermal/electrical), quality engineers and procurement specialists
Related standards
Keywords: IEC TR 62258-8, EXPRESS model schema, semiconductor die products, data exchange, STEP Physical File, ISO 10303, DDX format, wafer data, die simulation, traceability.