IEC TS 62878-2-3:2015

Overview

IEC TS 62878-2-3:2015 is an international technical specification published by the International Electrotechnical Commission (IEC) providing comprehensive design guidelines for device embedded substrates (DES). Device embedded substrates are advanced electronic circuit boards with embedded discrete active and passive devices within organic base materials. This part of IEC 62878 offers crucial guidance on circuit design, structural layout, manufacturing, assembly (known as jisso), and testing principles for DES, enabling engineers and manufacturers to optimize design and production processes.

The standard plays a vital role in establishing a common understanding for industry players by addressing the key aspects involved in embedding devices, including electrical connections such as vias, conductor plating, and conductive printing. However, it specifically excludes re-distribution layers (RDL) and certain electronic modules defined by IEC 62421.

Key Topics

• Design Principles for Device Embedded Substrates
  The document outlines design considerations similar to traditional electronic circuit boards but tailored for embedded device integration. It covers layer definitions, conductor spacing at terminals, and surface specifications on both top and bottom surfaces of the substrate.

• Structure and Layer Definitions
  IEC TS 62878-2-3 elaborates on the multi-layer architecture of device embedded substrates, including pad and via connections. It clarifies dielectric gaps, layer gaps, and interconnection positions essential for reliable substrate design.

• Base and Embedding Conditions
  The specification details the necessary conditions for preparing substrates and embedding devices, offering recommendations for assembly techniques and materials used to ensure quality and performance.

• Assembly Processes (Jisso)
  Guidance on embedding discrete components during substrate fabrication is provided, discussing optimal methodologies to integrate devices effectively without compromising substrate integrity.

• Design Specification Templates
  The standard provides templates and graphical indications for device embedded substrate design specifications, ensuring consistent documentation and clear communication among stakeholders.

Applications

IEC TS 62878-2-3:2015 serves as a critical resource for industries involved in:

• Electronic Circuit Board Manufacturing
  Assisting PCB designers and manufacturers in embedding active and passive devices within substrates for enhanced miniaturization and functionality.

• Consumer Electronics and Telecommunications
  Enabling compact and high-performance substrate design essential for smartphones, tablets, and high-frequency communication devices.

• Automotive and Industrial Electronics
  Providing design methodologies that meet high reliability and environmental robustness requirements for embedded substrate technologies.

• Research & Development in Electronics Assembly
  Facilitating innovation in electronic packaging by promoting a thorough understanding of structural and design parameters of device embedded substrates.

Related Standards

For comprehensive understanding and practical implementation, IEC TS 62878-2-3 is used alongside the following standards:

• IEC 62878-1-1 – Test methods for device embedded substrates; for verifying quality and performance through defined testing procedures.

• IEC TS 62878-2-1 – General description of device embedded substrate technology; foundational knowledge for the series.

• IEC TS 62878-2-4 – Test element groups specifications; detailing the test structures used for process and performance evaluation.

• IEC 60194 – Printed board design, manufacture, and assembly – Terms and definitions; essential for consistent terminology.

• IEC 62421 – Defines electronic modules excluded by IEC 62878 series; relevant for understanding scope boundaries.

Conclusion

IEC TS 62878-2-3:2015 is an essential design guide standard for professionals engaged in the development, manufacturing, and assembly of device embedded substrates. By providing a detailed framework on structural design, embedding practices, and testing considerations, it supports electronic industries striving for miniaturization, integration, and enhanced substrate reliability.

Adhering to this IEC technical specification ensures that electronic circuits with embedded devices meet international best practices, thereby contributing to innovative, compact, and high-performance electronics solutions worldwide.

Keywords: Device embedded substrate design, IEC TS 62878-2-3, embedded devices, substrate design guide, electronic circuit board standards, PCB embedded components, jisso assembly processes, organic base material substrate, embedded passive devices, IEC standards for electronics.