ISO 16525-3:2014

Name: ISO 16525-3:2014 — Adhesives — Test methods for isotropic electrically conductive adhesives — Part 3: Determination of heat-transfer properties
SKU: ISO 16525-3:2014
Price: 25 EUR
Availability: InStock

Adhesives — Test methods for isotropic electrically conductive adhesives — Part 3: Determination of heat-transfer properties

Название (английский):

ISO 16525-3:2014

Adhesives — Test methods for isotropic electrically conductive adhesives — Part 3: Determination of heat-transfer properties

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 16
Дата публикации:: 9 мая 2014 г.
Издание:: ISO IS 16525 edition 1 version 1
ICS:: 83.180

Тип поставки:

Full version25 €Ask AI2 €Read online 24h10 €Read online 72h15 €

Язык документа:

ruen

Срок поставки:1 рабочий день

Цена:25 €

Описание (английский):

ISO 16525-3:2014 specifies test methods for heat-transfer properties such as effective thermal conductivity and thermal resistance by a steady-state comparative longitudinal heat-flow method (SCHF method) using cartridge-type specimen for isotropic electrically conductive adhesives used in wiring, die attach, and surface assembly.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

ISO 16525-3:2014 - "Adhesives - Test methods for isotropic electrically conductive adhesives - Part 3: Determination of heat‑transfer properties" - specifies laboratory test methods to quantify heat‑transfer characteristics (effective thermal conductivity, thermal resistance and thermal conductance) of isotropic electrically conductive adhesives. The standard defines a steady‑state comparative longitudinal heat‑flow measurement - the SCHF method - using a cartridge‑type specimen sandwiched between standard rods to determine heat flow and temperature gradients for applications such as wiring, die‑attach and surface assembly.

Key technical topics and requirements

Test principle: Steady‑state comparative longitudinal heat‑flow (SCHF) method measuring longitudinal heat flux through a cartridge‑type specimen and standard rods with known thermal conductivity.

Measured properties:

Effective thermal conductivity (keff), which includes interfacial thermal resistance
Thermal resistance (R) and thermal conductance (K)

Specimens and fixtures: Cartridge‑type specimen geometry, dimensions and preparation procedures; use of square or cylindrical standard rods as reference elements.

Apparatus: Requirements for measurement system components - heating block, cooling block, thermal insulator, thermocouple holes, thermocouples (stability and accuracy requirements), pressure/regulation unit (screw, load cell), and data acquisition.

Temperature control: Heating and cooling equipment able to maintain specimen temperatures (room temperature up to 125 °C) with ±0.5 K fluctuation limits.

Measurement limits: The standard defines measurable ranges for thermal conductance and explains how specimen dimensions (thickness, side length) affect lower and upper measurement limits.

Procedure and calculations: Assembly, steady‑state attainment, thermocouple placement, calculation formulas for keff, R and K, and required contents for the test report.

Normative references: Geometrical measurement and surface texture standards, temperature and thermocouple guidance (e.g., IEC 60584‑1).

Practical applications and users

Who benefits:

Adhesive manufacturers validating thermal performance of electrically conductive adhesives

Electronics packaging and assembly engineers (die attach, flip‑chip, board‑level interconnects)

Test laboratories and quality control teams verifying thermal data for component reliability

Materials R&D teams developing conductive adhesives with targeted thermal properties

Why use it:

Provides a repeatable, standardized method to compare heat‑transfer performance across materials and batches

Captures interfacial thermal effects relevant to real assembly conditions

Supports design decisions in thermal management, reliability assessment, and material selection for wiring, die‑attach and surface assembly processes

Related standards

ISO 16525 (Parts 1–9) - general and other test methods for isotropic electrically conductive adhesives

ISO 3611, ISO 4287, ISO 13385‑1/2 (dimensional and surface measurement)

ISO 17212 (surface preparation guidelines)

ISO 80000‑1 (quantities and units)

IEC 60584‑1 (thermocouple reference tables)

Keywords: ISO 16525-3:2014, isotropic electrically conductive adhesives, thermal conductivity test, SCHF method, cartridge‑type specimen, thermal resistance, die attach thermal testing, electronic assembly thermal properties.

ISO 16525-3:2014

Abstract

Похожие стандарты

Overview

Key technical topics and requirements

Practical applications and users

Related standards

Технические детали

IEC 60584-1:2013

Thermocouples - Part 1: EMF specifications and tolerances

ISO 16525-6:2014

Adhesives — Test methods for isotropic electrically conductive adhesives — Part 6: Determination of pendulum-…

BS EN ISO 3611:2023

Geometrical product specifications (GPS). Dimensional measuring equipment. Design and metrological characteri…

ISO 4287:1997

Geometrical Product Specifications (GPS) — Surface texture: Profile method — Terms, definitions and surface t…

BS EN ISO 13385-1:2019

Geometrical product specifications (GPS). Dimensional measuring equipment. Design and metrological characteri…

ISO 17212:2012

Structural adhesives — Guidelines for the surface preparation of metals and plastics prior to adhesive bonding

ISO 80000-12:2019

Quantities and units - Part 12: Condensed matter physics