ISO 16525-9:2014

Name: ISO 16525-9:2014 — Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics
SKU: ISO 16525-9:2014
Price: 25 EUR
Availability: InStock

Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics

Название (английский):

ISO 16525-9:2014

Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 45
Дата публикации:: 22 мая 2014 г.
Издание:: ISO IS 16525 edition 1 version 1
ICS:: 83.180

Тип поставки:

Full version25 €Ask AI2 €Read online 24h10 €Read online 72h15 €

Язык документа:

ruen

Срок поставки:1 рабочий день

Цена:25 €

Описание (английский):

ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

ISO 16525-9:2014 defines standardized test methods for determining high-speed signal‑transmission characteristics of isotropic electrically conductive adhesives (ICA). It covers measurements in bonded regions where an ICA joins surface‑mounted device (SMD) terminals to printed circuit board (PCB) land patterns, and for ICA‑printed wiring on PCBs. The standard focuses on extracting the adhesive’s contribution to signal integrity (eye pattern, scattering parameters, TDR, impedance) while minimising the unavoidable influence of surrounding copper traces.

Key topics and technical requirements

Two evaluation approaches:

Measure high‑speed transmission of a printed wiring pattern formed with ICA.
Measure bonded joints where SMD terminals are attached with ICA, using lead‑free solder as a reference.

Signal integrity metrics:

Eye pattern analysis for digital random pulses (characteristics of high‑speed signal transmission).
Scattering parameters (S11, S21) measured with a network analyser to quantify frequency response.
Time‑domain reflectometry (TDR) for characteristic impedance profiling and reflection analysis.

Recommended apparatus and ranges:

Random pulse generator (≈0.05–12 Gbps) and oscilloscope (up to 18 GHz).
SMA coaxial connectors rated to ~20 GHz; network analyser typically 50 MHz–40 GHz (measurement commonly 100 MHz–30 GHz).
TDR oscilloscope with step rise time ≲30 ps.

Test board and sample design:

FR‑4 (glass‑fabric epoxy) substrates and defined PCB patterns to match 50 Ω test equipment and minimise copper line influence.
Procedures for subtracting the copper‑only baseline to isolate ICA behavior.

Documentation: Procedures for board preparation, apparatus setup, pass/fail judgement and reporting are specified, plus normative annexes with sample structures, implementation examples and application methods.

Applications

Quantifying the high‑frequency performance of ICAs used for:

BGA and other SMD interconnections where solder is impractical.
Printed conductive traces formed from adhesive on PCB substrates.

Assessing whether an ICA is suitable for high‑speed digital interfaces in consumer electronics, telecommunications, automotive or industrial electronics.

Comparative testing of adhesive formulations for signal integrity and design validation of ICA‑based interconnects.

ISO 16525-9:2014

Abstract

Похожие стандарты

Overview

Key topics and technical requirements

Applications

Who should use this standard

Related standards

Технические детали

ISO 4725:2004

Oil of cedarwood, Texas (Juniperus mexicana Schiede)

IEC 60194-2:2017

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologie…

IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality i…

IEC 61192-1:2003

Workmanship requirements for soldered electronic assemblies - Part 1: General

IEC 61249-2-7:2002

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad…

IEC 61760-1:2026

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (S…