IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Название (английский):
IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 15
- Дата публикации:
- 11 июля 2007 г.
- Издание:
- IEC IS 62137 edition 1 version 1
- ICS:
- 31.190
Тип поставки:
Язык документа:
Срок поставки:1 рабочий день
Цена:35 €
Описание (английский):
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Abstract
Похожие стандарты
Стандарты, упомянутые в описании