IEC 60191-6-19:2010 PDF

Name: IEC 60191-6-19:2010 — Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
SKU: IEC 60191-6-19:2010
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Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Название (английский):

IEC 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 25
Дата публикации:: 25 февраля 2010 г.
Издание:: IEC IS 60191 edition 1 version 1
ICS:: 31.080.01

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Описание (английский):

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Abstract

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Стандарты, упомянутые в описании

Overview

IEC 60191-6-19:2010 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the mechanical standardization of semiconductor devices. Specifically, it details measurement methods for package warpage at elevated temperatures and establishes the maximum permissible warpage for key semiconductor package types including Ball Grid Array (BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This edition supersedes the IEC/PAS 60191-6-19 from 2008 and provides a technical revision to align with the latest industry practices.

The standard defines critical testing parameters and procedures necessary to assess warpage- the deformation or bending - of semiconductor device packages when subjected to high temperature conditions, which can significantly impact device reliability and solder joint integrity during assembly and operation.

Key Topics

Measurement Methods for Package Warpage The document outlines standardized procedures to measure warpage using advanced non-contact techniques such as:

Shadow Moiré method
Laser reflection method These methods offer accurate, repeatable detection of warpage profiles across the measuring area of semiconductor packages.

Measuring Area Definition The standard delineates the exact areas on packages where warpage should be measured to ensure consistency.

For BGAs and FBGAs, the measuring area is typically bounded by the outermost solder balls.
For FLGAs, it covers the substrate surface excluding an edge margin to avoid noise from measurement instruments.

Warpage Characterization and Sign Determination Definitions are provided for terms such as convex warpage (arched surface with positive sign) and concave warpage (inward curve with negative sign). The standard describes a method to calculate the overall warpage sign based on displacement measurements along specified diagonals of the measuring area.

Maximum Permissible Warpage Values IEC 60191-6-19 prescribes allowable limits of warpage at elevated temperature for different package types to ensure mechanical reliability during soldering and thermal cycling.

Data Presentation and Datasheet Recommendations The standard recommends formats for presenting warpage data in device datasheets, including measurement temperature profiles and graphical representations to support end-users in evaluating package suitability for their applications.

Applications

Semiconductor Package Quality Control Manufacturers can implement these measurement methods during design validation and production to detect excessive package warpage early, preventing downstream defects such as solder joint cracks or open circuits.

Thermal Reliability Testing Applied in thermal cycling and high-temperature solder reflow processes to monitor the mechanical stability of BGAs, FBGAs, and FLGAs, ensuring compliance with assembly specifications.

Design Optimization Package designers can leverage defined warpage limits and measurement outcomes to optimize substrate materials and structures, improving overall device performance and solderability.

Supplier Qualification and Certification Electronics companies and contract manufacturers may require compliance to IEC 60191-6-19 to qualify suppliers and certify semiconductor packages for use in sensitive applications like automotive, aerospace, and consumer electronics.

Related Standards

IEC 60191-6-2 Mechanical standardization – General rules for outline drawings of surface-mounted semiconductor device packages, focusing on design guides for ball and column terminal packages with different pitches.

IEC 60191-6-5 Mechanical standardization – Design guide specific to fine-pitch ball grid arrays (FBGA), providing parameters complementary to warpage measurement.

IEC 60749-20 Test methods for resistance of plastic-encapsulated surface-mounted devices to combined moisture and soldering heat, relevant for assessing package reliability under harsh environmental conditions.

Conclusion

IEC 60191-6-19:2010 provides a critical framework for measuring and limiting package warpage in semiconductor devices under elevated temperatures. By standardizing these methods, this IEC standard supports enhanced reliability, quality control, and manufacturing efficiency across the semiconductor industry. Adopting this standard enables better mechanical performance and reduces failure risks during soldering and thermal stress, making it an essential reference for semiconductor package manufacturers, electronic assemblers, and quality assurance engineers.

IEC 60191-6-19:2010 PDF

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Conclusion

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