IEC 60512-6-2:2002 PDF
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 9
- Дата публикации:
- 21 февраля 2002 г.
- Издание:
- IEC IS 60512 edition 1 version 1
- ICS:
- 31.220.10
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
Abstract
Overview
The IEC 60512-6-2:2002 standard, published by the International Electrotechnical Commission (IEC), specifies a standardized test method--to evaluate the durability and robustness of connectors for electronic equipment under dynamic mechanical stress. This document belongs to the series that covers various tests and measurements on connectors, providing a comprehensive framework to ensure quality, reliability, and performance in electronic components subjected to mechanical shocks.
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