Overview
IEC 61189-2-807:2021 is an international standard published by the International Electrotechnical Commission (IEC) that specifies a test method for determining the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). This standard is a critical reference for laboratories, manufacturers, and quality professionals involved in the production and evaluation of electrical materials, printed boards, and interconnection structures. Accurate determination of decomposition temperature is essential for ensuring the reliability and performance of electronic assemblies, particularly as end-use environments become increasingly demanding.
Key Topics
- Decomposition Temperature (Td): The standard defines procedures for measuring the Td of laminate materials, a key property influencing material selection and board performance.
- Thermogravimetric Analysis (TGA): The method utilizes TGA, an analytical technique that measures changes in mass as a function of temperature, providing precise thermal stability data.
- Test Specimen Preparation: Guidance is provided on specimen selection, including requirements for unclad or fully de-coppered laminates, and preparation to ensure reliable results.
- Preconditioning Protocols: The standard specifies preconditioning steps (such as drying specimens prior to testing) to minimize moisture influence and improve repeatability.
- Equipment Requirements: Outlines specifications for thermogravimetric analyzers, environmental controls (temperature and humidity), and calibration procedures.
- Data Reporting: The method includes requirements for comprehensive reporting, such as test conditions, equipment identification, heating rate, and observed decomposition points.
Applications
IEC 61189-2-807:2021 serves several practical applications in the electronics industry:
- Quality Assurance of Electronic Materials: Enables consistent verification of the thermal performance of base laminates, supporting compliance with stringent reliability standards in sectors such as automotive, aerospace, medical devices, and telecommunications.
- Materials Development and Selection: Assists engineers and designers in evaluating and comparing different laminate materials for use in printed circuit boards (PCBs) and assemblies, ensuring that only materials with suitable thermal properties are chosen for high-reliability end uses.
- Failure Analysis and Reliability Testing: Provides a reliable method for root-cause analysis of material failure due to thermal decomposition, helping manufacturers improve designs and processes.
- Conformity Assessment: Offers an internationally recognized testing procedure that supports supplier audits, customer requirements, and regulatory compliance, facilitating global trade and procurement.
Related Standards
- IEC 60194-2: Vocabulary for printed board design, manufacture, and assembly technologies, referenced for definitions and terminology consistency.
- ISO 11358-1: General principles of thermogravimetry for polymers, cited for equipment calibration and test accuracy.
- IPC-TM-650 Methods 2.3.40 and 2.4.24.6: Industry-recognized IPC test methods for thermal stability and decomposition temperature of laminate materials using TGA.
- ASTM D3850-19: Standard method for rapid thermal degradation analysis of solid electrical insulating materials via TGA, providing complementary procedures for the electrical industry.
By following IEC 61189-2-807:2021, organizations can ensure precise, repeatable, and globally harmonized assessment of laminate decomposition temperature, ultimately underpinning product safety, reliability, and performance in electronic assemblies.