IEC 63003:2015 PDF

Name: IEC 63003:2015 — Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™
SKU: IEC 63003:2015
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Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

Название (английский):

IEC 63003:2015

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 162
Дата публикации:: 14 декабря 2015 г.
Издание:: IEEE IS 63003 edition 1 version 1
ICS:: 01

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Описание (английский):

IEC 63003:2015(E) the scope is the definition of a pin map utilizing the IEEE 1505 receiver fixture interface (RFI). The pin map defined within this standard shall apply to military and aerospace automatic test equipment (ATE) testing applications.

Abstract

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Упомянутые в описании и другие стандарты IEC

Overview

IEC 63003:2015 (IEEE Std 1505.1-2008) defines a common pin map configuration for high‑density, single‑tier electronics test requirements by extending the IEEE Std 1505 receiver fixture interface (RFI). The standard specifies how a common test interface (CTI) pin map is to be implemented for military and aerospace automatic test equipment (ATE/ATS) applications to ensure mechanical and electrical interoperability across legacy and future test systems.

Key topics and requirements

This standard focuses on standardizing the electrical pin‑out and related physical interfaces so that Test Program Sets (TPS) and unit‑under‑test (UUT) connections can be shared across different ATE platforms:

CTI pin map configuration: A defined, scalable pin map for general purpose electronic testing that maps signal types to connector contacts without requiring unique vendor pin‑outs.

Receiver Fixture Interface (RFI) alignment: Uses the IEEE 1505 RFI mechanical interface as the basis for electrical pin assignments to assure mechanical/electrical compatibility.

Connector modules and contacts: Specifies the use of specific connector modules and contact types (footprint standardization) to support high‑density mass termination.

Recommended switching implementation: Guidance on switching architectures and legacy ATE transitional devices to support backward compatibility.

Performance and system requirements: Coverage of reliability, maintainability, scalability, cost considerations, and vertical integration test support.

Pin map I/O configuration: Definitions for analog, digital, bus, instrument control, power supplies/loads, sense/control, switching and system signals (see normative Annex A for categories).

Physical and parametric requirements: Connector footprint, parametric electrical requirements and mechanical framework requirements to support interoperability.

Open system and interoperability: Emphasis on open system design and TPS portability across heterogeneous ATE environments.

Practical applications and who uses it

IEC 63003:2015 is intended for organizations and professionals involved with electronic test systems where interoperability and TPS portability are critical:

Military and aerospace test engineers designing fixtures and receiver interfaces for avionics and defense electronics.

ATE/ATS manufacturers implementing RFI‑compatible receiver fixtures and scalable pin maps.

Test program developers seeking to create TPSs that operate across multiple vendors’ equipment.

Systems integrators and procurement teams tasked with deploying interoperable test infrastructure and ensuring long‑term maintainability and cost efficiency.

Keywords: IEC 63003:2015, IEEE Std 1505.1, CTI pin map, receiver fixture interface, ATE, ATS, interoperability, pin‑out, high‑density, mass termination, UUT, TPS.

IEC 63003:2015 PDF

Abstract

Похожие стандарты

Overview

Key topics and requirements

Practical applications and who uses it

Related standards

Технические детали

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