IEC TR 62433-4-1:2025 PDF

Name: IEC TR 62433-4-1:2025 — EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB
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EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB

Название (английский):

IEC TR 62433-4-1:2025

EMC IC modelling - Part 4-1: Use of ICIM-CI model to predict the IC conducted immunity in a PCB

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 40
Дата публикации:: 26 августа 2025 г.
Издание:: IEC TR 62433 edition 1 version 1
ICS:: 31.200

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Описание (английский):

IEC TR 62433-4-1:2025 provides an overview of good practices to extract an ICIM-CI model from measurements and to build a numerical model of the PCB in which the ICIM-CI model is used to predict RF immunity of an IC in its application PCB. This document also discusses factors which can be considered to obtain proper results in an ICIM-CI model extraction and use of the actual model at the PCB level.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

IEC TR 62433-4-1:2025 is a technical report developed by the International Electrotechnical Commission (IEC) focusing on electromagnetic compatibility (EMC) integrated circuit (IC) modeling. Specifically, this document addresses the use of the ICIM-CI (Integrated Circuit Immunity Model for Conducted Immunity) model to predict the RF conducted immunity performance of an IC when it is mounted on a printed circuit board (PCB). The technical report offers comprehensive guidance on best practices for extracting an ICIM-CI model from laboratory measurements, constructing corresponding numerical PCB models, and effectively utilizing these models to forecast IC immunity at the application level.

Key Topics

EMC in Integrated Circuits: Understanding the mechanisms of RF immunity for ICs embedded in electronic systems.

ICIM-CI Model Extraction: Detailed methods for extracting ICIM-CI models using measurements such as S-parameters, Y-parameters, or Z-parameters, and converting model data for simulation use.

PCB-Level Immunity Prediction: Procedures for building PCB models that incorporate the ICIM-CI to simulate and predict immunity to conducted RF disturbances (e.g., via DPI - Direct Power Injection tests).

Model Structure: The ICIM-CI model consists of two main blocks:

PDN – Passive Distribution Network: Represents the impedance path from the external environment to the IC, typically modeled with RLC parasitics.
IB – Immunity Behaviour: Describes how the IC outputs respond to RF disturbances, providing thresholds for immunity.

Practical Considerations: Identification of relevant IC pins for disturbance injection and output monitoring, addressing both linear (PDN) and non-linear (IB) behaviors.

Failure Criteria and Validation: Determining operational thresholds for immunity and validating the model through comparison with actual test results.

Measurement and Simulation Techniques: Methods for performing conducted immunity characterizations and using SPICE or other simulation environments to analyze IC behaviour under RF stress.

Applications

Component-Level Immunity Assessment: Semiconductor manufacturers and EMC engineers can use IEC TR 62433-4-1:2025 to model and simulate the RF immunity of ICs before and after placement on a PCB, reducing the risk of EMC failures in final products.

Automotive Electronics: With increasing use of communication protocols like LIN, CAN, and more, robust immunity prediction is essential for automotive safety and compliance.

Industrial and Consumer Electronics: The standard is applicable to any electronic application where ICs are exposed to conducted RF disturbances and there is a need to ensure EMC performance at the PCB level.

Qualification and Verification: Enables the prediction of IC immunity without repeated, costly, and time-consuming physical requalification, supporting faster development cycles and second source validation.

Related Standards

IEC 62433 Series – EMC IC Modelling: Other parts of this series provide foundational concepts (IEC 62433-4:2016) and detailed methodologies for different aspects of IC EMC modeling.

IEC 62132-4 – DPI Test Method: Specifies the DPI (Direct Power Injection) method referenced extensively for immunity measurements.

IBIS (Input/Output Buffer Information Specification): Used for signal integrity modeling, referenced in the context of PDN extraction.

ISO/IEC Terminology Standards: For unified definitions and abbreviations relevant to EMC and IC modeling (refer to IEC Electropedia and related ISO/IEC databases).

Practical Value

IEC TR 62433-4-1:2025 helps the electronics industry address RF immunity challenges at the component and PCB level by standardizing modeling practices. By leveraging ICIM-CI models, organizations can:

Predict and optimize the EMC performance of ICs in the early design phase.

Diagnose and troubleshoot immunity issues more efficiently.

Reduce the number of physical tests required, lowering costs and accelerating time-to-market.

Support reliable and compliant product development for global markets, especially in automotive and high-reliability sectors.

Keywords: IEC TR 62433-4-1, ICIM-CI, EMC, RF immunity modelling, conducted immunity, PCB, power distribution network, DPI test, simulation, PDN extraction, IB model, automotive EMC, electronic design standards.

IEC TR 62433-4-1:2025 PDF

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Practical Value

Технические детали

IEC 62433-4:2016

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted i…

IEC 62433-1:2019/COR1:2020

Corrigendum 1 - EMC IC modelling - Part 1: General modelling framework

IEC 62132-4:2006

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power inje…