ISO 9453:2020 PDF
Soft solder alloys — Chemical compositions and forms
Soft solder alloys — Chemical compositions and forms
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 13
- Дата публикации:
- 24 сентября 2020 г.
- Издание:
- ISO IS 9453 edition 4 version 1
- ICS:
- 25.160.50
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Abstract
Overview
ISO 9453:2020 - Soft solder alloys - Chemical compositions and forms - defines chemical composition limits and typical product forms for used to join metallic parts. The standard covers alloys that contain two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and cadmium, and distinguishes between and alloy groups. It also provides guidance on sampling, analysis, marking, labelling and packaging.
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