SIST EN ISO 9453:2020 PDF
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 21
- Дата публикации:
- 28 октября 2020 г.
- ICS:
- 25.160.50
- Технический комитет:
- VAR - Welding
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Abstract
Overview
EN - Soft solder alloys: Chemical compositions and forms specifies the chemical composition requirements and common product forms for soft solder alloys. The standard covers alloys that contain two or more of: . Published as an ISO document and adopted by CEN (EN ), this fourth edition (2020) supersedes the 2014 version and includes updates such as new alloy entries and alignment with IEC alloy naming.
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