ISO 9455-14:2017 PDF

Name: ISO 9455-14:2017 — Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
SKU: ISO 9455-14:2017
Price: 25 EUR
Availability: InStock

Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues

Название (английский):

ISO 9455-14:2017

Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 4
Дата публикации:: 17 августа 2017 г.
Издание:: ISO IS 9455 edition 2 version 1
ICS:: 25.160.50

Тип поставки:

Full version60 €Read online 24h10 €Read online 72h15 €

Язык документа:

ruen

Срок поставки:1 раб. дн. (перевод)

Цена:60 €

Описание (английский):

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

ISO 9455-14:2017 specifies a qualitative method for assessing the tackiness of flux residues left after soft soldering processes. The method applies to all flux forms: solid and paste fluxes, liquid fluxes, solder pastes and flux-cored solder wires. It is particularly appropriate where residues remain in situ on electrical and electronic equipment, supporting quality control and reliability assessments.

The principle is simple: a standard mass of solder (or solder form) and a defined amount of flux are melted on a prepared copper test piece. After cooling, the residue is dusted with powdered chalk and the ease of chalk removal by light brushing determines whether the residue is tacky or not tacky.

Key Topics

Scope and applicability: All soft solder fluxes, solder pastes and flux-cored wires; focused on residues left on electronic assemblies.

Principle: Melt flux/solder on a copper test piece; cool; apply powdered chalk; brush and observe removal.

Test pieces and preparation:

0.5 mm thick copper sheet test pieces with a central depression are cleaned and degreased according to the method.
Flux quantities are controlled so that non-volatile matter is between 0.035 g and 0.040 g where applicable.

Heating and solder selection:

Typical solder options in the standard include Sn60Pb40 at (235 ± 3) °C and Sn96Ag3Cu0.5 at (255 ± 3) °C, or an agreed temperature 35 ± 3 °C above the alloy liquidus.

Evaluation criterion:

If chalk powder is easily removed by brushing → not tacky.
If chalk cannot be removed, or only with difficulty → tacky.

Test reporting: Identification of sample, reference to ISO 9455-14, results, unusual features, any deviations, and date.

Applications

Electronics assembly quality assurance and incoming flux inspection.

Comparative screening during flux formulation and supplier evaluation.

Field or in-situ assessments where residues remain on PCBs or components and residue tack influences handling or reliability.

Supporting process control decisions for cleaning requirements and post-soldering treatments.

Related Standards

ISO 9455-1 - Determination of non-volatile matter, gravimetric method (referenced for liquid flux preparation).

ISO 9455-2 - Determination of non-volatile matter, ebulliometric method.

ISO 9453 - Soft solder alloys - chemical compositions and forms (solder specifications used for temperature selection).

ISO 197-1 - Copper and copper alloys - terms and definitions - materials (copper test piece specification).

This concise method offers a rapid, qualitative indicator of tacky residues that can affect handling, cleaning decisions and long-term performance of electronic assemblies.

ISO 9455-14:2017 PDF

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Технические детали

SIST EN ISO 9455-14:2018

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

SIST EN ISO 9455-17:2024

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical m…

SIST EN ISO 9455-2:2001

Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (IS…

SIST EN ISO 9453:2020

Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)

SIST EN ISO 19712-3:2022

Plastics - Decorative solid surfacing materials - Part 3: Determination of properties - Solid surface shapes…