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Overview IEC 60191-6-16:2007 is an international standard published by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor devices, specific…
Overview IEC 60191-6-17:2011 is an international standard published by the International Electrotechnical Commission (IEC) that addresses the mechanical standardization of semiconductor devices, spec…
Overview IEC 60191-6-13:2016 is an international standard developed by the International Electrotechnical Commission (IEC) for the mechanical standardization of semiconductor device sockets. Specific…
Overview IEC 60191-6-18:2010 outlines the mechanical standardization of semiconductor device packages, focusing specifically on surface mounted ball grid array (BGA) packages with a terminal pitch of…
Overview IEC 60191-6-19:2010 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the mechanical standardization of semiconductor devices. Spe…
Overview IEC 60191-6-12:2011 is an international standard established by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor devices. Specif…
Overview IEC 60191-6-10:2003 - "Mechanical standardization of semiconductor devices - Part 6-10" defines the general rules, common outline drawings and dimensional requirements for P‑VSON (plastic ve…
Overview IEC 60191-6-13:2007 is an IEC design guideline for open-top-type sockets used with Fine‑pitch Ball Grid Array (FBGA) and Fine‑pitch Land Grid Array (FLGA) semiconductor packages. It standard…
Overview IEC 60191-6-1:2001 specifies the general rules for the preparation of outline drawings for surface mounted semiconductor device packages with gull-wing lead terminals. Developed by the Inter…